Power/Performance Bits: Jan. 3


Optical device integration Researchers from the University of Strathclyde, University of Glasgow, and the Australian National University propose a way to place multiple micron-scale optical devices made from different materials close together on a single silicon chip. “The development of electronics that are based on silicon transistors has enabled increasingly more powerful and flexible ... » read more

New Glasses Target Aspects Of AR & VR


Despite all the recent noise about the Metaverse (and Facebook changing its company name to Meta), I remain convinced that augmented reality (AR) is going to be more important than virtual reality (VR), at least in the medium term. For one thing, virtual reality headsets are large and expensive, at least today. I'm also not convinced that we all want to live in a virtual world like that...but I... » read more

Power/Performance Bits: Oct. 26


Printing circuits on irregular shapes Researchers at Pennsylvania State University propose a way to print biodegradable circuits on irregular, complex shapes. “We are trying to enable direct fabrication of circuits on freeform, 3-D geometries,” said Huanyu “Larry” Cheng, professor in Penn State's Department of Engineering Science and Mechanics (ESM). “Printing on complicated objec... » read more

Get Ready For The Next Generation Of Wearable Tech


Wearables have attracted a lot of attention recently, due to both their successes as well as failures. They bring together requirements for packaging, new substrates, power scavenging, low-power, novel connectivity, flexibility, durability, as well as fashion. While some of the challenges remain formidable, the long-term potential is driving the industry to look at what is possible. They are... » read more

Six Things We Might Need For Pervasive Computing


There is little doubt that digital technology will become more pervasive than it is even now in the coming decades. Organizations like the Exponential Group argue that digital should be the first step in sustainability, estimating that hardware and software could help reduce emissions by 15% by 2030 and beyond by helping fine-tune buildings, factories, and other environments. Cars—already ... » read more

Power/Performance Bits: Oct. 5


Modeling resistive-switching memory Researchers from Singapore University of Technology and Design (SUTD) and Chang Gung University developed a new toolkit for modeling current in resistive-switching memory devices. The team said that traditional physical-based models need to consider complex behaviors to model current in resistive memory, and there's a risk of permanent device damage due t... » read more

Wearables Disconnect


One of the great opportunities created by the pandemic is a result of conferences going online. I know many people miss the social aspects of not being able to get together with your thousand closest friends, who you see every year at the same shows, but requiring a physical presence is limiting in both time and expense. Personally, I have used the opportunity to "attend" conferences that I wou... » read more

Power/Performance Bits: Sept. 21


Catching switches in action Researchers from SLAC National Accelerator Laboratory, Stanford University, Hewlett Packard Labs, Penn State University, and Purdue University observed atoms moving inside an electronic switch as it turns on and off, revealing a state they suspect could lead to faster, more energy-efficient devices. "This research is a breakthrough in ultrafast technology and sci... » read more

Will The Fitbit Charge 5 Outshine The Fitbit Luxe?


We don’t know, and we do not comment on whether one device is better than its previous generation. What we do is look at and compare generations of devices. And while we wait for our pre-order of our Fitbit Charge 5 to arrive, we will take a look at what Fitbit Luxe has inside of it. Fig. 1: Fitbit Luxe. Fig. 2: Fitbit Inspire 2. The Luxe has other changes from the Inspire 2, inc... » read more

System-In-Package Thrives In The Shadows


IC packaging continues to play a big role in the development of new electronic products, particularly with system-in-package (SiP), a successful approach that continues to gain momentum — but mostly under the radar because it adds a competitive edge. With a SiP, several chips and other components are integrated into a package, enabling it to function as an electronic system or sub-system. ... » read more

← Older posts Newer posts →