tag: wide bandgap

Status of WBG Device Reliability in Automotive (U. Bremen et al.)
By Technical Paper Link - 31 Mar, 2026 - Comments: 0

A new technical paper, "Reliability of Wide Bandgap Semiconductors for Automotive Applications," was published by the Universitat Bremen, Technische Universitat Chemnitz, BMW, Robert Bosch GmbH, Infineon, Semikron Danfoss, and FH Dortmund. Abstract "Wide bandgap (WBG) semiconductor devices offer tremendous advantages over their silicon counterparts. Automotive applications benefit particu... » read more

CMOS-Compatible Approach to Extending the Spectral Response of Oxide Semiconductors
By Technical Paper Link - 26 Feb, 2026 - Comments: 0

A new technical paper titled "Sputtering-driven formation of interstitial oxygen for intrinsic NIR detection in IGZO phototransistor" was published by researchers at KICET, Korea University, Yonsei University, and Argonne National Lab. Abstract "Amorphous indium gallium zinc oxide (a-IGZO) is a promising wide-bandgap semiconductor for large-area optoelectronics; however, its intrinsic ins... » read more

Topology Selection For Bidirectional Energy Flow Applications Using WBG Devices
By Infineon - 07 Jan, 2026 - Comments: 0

The paper provides an overview of the topology for bidirectional converters and discusses their different usage. Bidirectional energy flow applications are usually found in energy storage systems, battery systems, and can be categorized as grid-connected and DC-DC-connected. In grid-connected applications, two power conversion stages, which are power factor corrector (PFC) rectifier/inverter an... » read more

The Race To Replace Silicon
By M. Rameez Arif - 24 Jul, 2025 - Comments: 1

For over 75 years, silicon has been the dominant material in the evolution of modern electronics, powering everything from smartphones to satellites. But as chipmakers push toward smaller nodes, higher power efficiency, and quantum-scale precision, a pressing question is echoing across fabs and R&D labs worldwide: Is it time to move beyond silicon? In this blog post, we explore the growi... » read more

Enhancing AI Datacenter PSUs With Hybrid-Si, SiC, And GaN Power Devices
By Infineon - 30 Apr, 2025 - Comments: 0

The rapid growth of artificial intelligence (AI) is driving an unprecedented demand for processing power in data centers, resulting in a surge in power demand at the rack level. With the existing data center rack sizes, the challenge is to deliver more power and efficiency in the same physical footprint apart from costs and cooling. To address this, Infineon has developed a range of hybrid powe... » read more

Using TCAD To Simulate Wide-Bandgap Materials For Electronics Design
By Shela Aboud - 22 Jan, 2024 - Comments: 0

Wide-bandgap (WBG) semiconductors are a class of materials that can offer a range of advantages over silicon. These materials can operate at higher voltages and higher temperatures, serving as critical enablers of innovation in Power and RF applications and functioning in a wider range of environments that are sometimes extreme. Electronics applications benefit from these wide-bandgap materials... » read more

Wide Bandgap Semiconductors: What Modeling Challenges Must We Overcome
By Emily Yan - 24 Aug, 2023 - Comments: 0

As power electronics shrink in size, the demands on power, frequency, and efficiency grow exponentially. The semiconductor industry is leaning heavily into wide bandgap materials like gallium nitride (GaN) and silicon carbide (SiC) to help meet these demands. Recent research projects that the global GaN semiconductor devices market will grow at a CAGR of 25.4% from 2023 to 2030. However, the ... » read more

SiC Growth For EVs Is Stressing Manufacturing
By Anne Meixner - 08 Aug, 2023 - Comments: 0

The electrification of vehicles is fueling demand for silicon carbide power ICs, but it also is creating challenges in finding and identifying defects in those chips. Coinciding with this is a growing awareness about just how immature SiC technology is and how much work still needs to be done — and how quickly that has to happen. Automakers are pushing heavily into electric vehicles, and t... » read more

Power Semiconductor Devices: Thermal Management and Packaging
By Technical Paper Link - 10 Apr, 2023 - Comments: 0

A technical paper titled "Thermal management and packaging of wide and ultra-wide bandgap power devices: a review and perspective" was published by researchers at Virginia Polytechnic Institute and State University, U.S. Naval Research Laboratory, and Univ Lyon, CNRS. "This paper provides a timely review of the thermal management of WBG and UWBG power devices with an emphasis on packaged dev... » read more

Technical Paper Round-up: June 14
By Linda Christensen - 14 Jun, 2022 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=33 /] Semiconductor Engineering is in the process of building this library of research papers. Please send suggestions (via comments section below) for what else you’d like us to incorporate. If you have research papers you are trying to promote, we will review them to see if they are a good fit f... » read more

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