tag: Xilinx

FPGAs Drive Deeper Into Cars
By Ann Mutschler - 09 Jul, 2018 - Comments: 3

FPGAs are reaching deeper and wider inside of automobiles, playing an increasingly important role across more systems within a vehicle as the electronic content continues to grow. The role of FPGAs in automotive cameras and sensors is already well established. But they also are winning sockets inside of a raft of new technologies, ranging from the AI systems that will become the central logi... » read more

Embedded FPGA Design Considerations
By Ed Sperling - 09 Jul, 2018 - Comments: 0

Geoff Tate, CEO of Flex Logix, talks about interconnects, memory, different design approaches, and why foundry processes are critical to eFPGA design. https://youtu.be/FngrgDnJn9c » read more

SoC FPGAs And HW/SW Co-Simulation
By Farhad Fallahlalehzari - 28 Jun, 2018 - Comments: 0

Heterogeneous System on Chip (SoC) devices like the Xilinx Zynq 7000 and Zynq UltraScale+ MPSoC combine a high-performance processing system (PS) with state-of-the-art programmable logic (PL). This combination allows a system to be architected to provide an optimally balanced single-chip software/hardware solution. However, all too often, the integration between the PS and PL takes place late... » read more

FPGAs Becoming More SoC-Like
By Ann Mutschler - 04 Jun, 2018 - Comments: 1

FPGAs are blinged-out rockstars compared to their former selves. No longer just a collection of look-up tables (LUTs) and registers, FPGAs have moved well beyond into now being architectures for system exploration and vehicles for proving a design architecture for future ASICs. This family of devices now includes everything from basic programmable logic all the way up to complex SoC devices.... » read more

Speeding Up High-Frequency Trading
By Sunil Sahoo - 24 May, 2018 - Comments: 0

The High-Frequency Trading (HFT) industry has received a lot of attention during the last few years. HFT is all about speed and minimizing latency: the faster you can run trading strategies and algorithms for analyzing minute price changes and executing trade orders, the higher the probability to win over competition. So the competition in this area is very fierce with market players continuous... » read more

Software-Defined Test And Measurement
By Jeff Dorsch - 07 May, 2018 - Comments: 0

Software-defined radios, instrumentation and test are ramping up alongside a flood of new technologies related to assisted and autonomous vehicles, 5G, and military/aerospace electronics, breathing new life and significant change into the test and measurement market. Software-defined test adds flexibility in markets where the products and protocols are evolving or still being defined, and wh... » read more

The Week In Review: Design
By Jesse Allen - 16 Mar, 2018 - Comments: 0

Tools Synopsys debuted new versions of its circuit simulation and custom design products. FineSim SPICE provides 2X faster simulation and Monte Carlo analysis speed, CustomSim FastSPICE offers 2X speed-up for post-layout SRAM simulation and maintains multi-core scalability by providing additional 2X speed-up on four cores, and HSPICE delivers 1.5X speed-up for large post-layout designs, accord... » read more

Trump Blocks Broadcom Bid for Qualcomm
By Jeff Dorsch - 12 Mar, 2018 - Comments: 0

President Trump has blocked Broadcom’s unsolicited, $117 billion takeover bid for Qualcomm, citing national security concerns. The president acted on the recommendation of the Committee on Foreign Investment in the United States, which cited the possibility of Qualcomm’s chip technology being compromised by Chinese interests, if it were acquired by Singapore-based Broadcom. The move is t... » read more

eSilicon Builds ASIC Business On Leading-Edge Chip Design
By eSilicon - 21 Feb, 2018 - Comments: 0

How advanced application specific integrated circuits (ASIC) chip design and manufacturing for leading-edge applications such as networking and artificial intelligence can be successfully outsourced. The company which has capabilities in 2.5D packaging, high-bandwidth memories (HBM), and silicon IP for fast memories and SerDes designs. The company has many leading system companies as custome... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 12 Jan, 2018 - Comments: 0

Chipmakers Intel and Micron have ended their long-running NAND joint development partnership. The companies will continue to develop NAND, but they will work independently on future generations of 3D NAND. The companies have agreed to complete the development of their third-generation of 3D NAND technology, which will be delivered towards the end of 2018. That is expected to be a 96-layer ... » read more

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