Challenges Mount In Inspection And Metrology

By Mark LaPedus - 12 Dec, 2013 - Comments: 0

Chipmakers are moving full speed ahead toward smaller process nodes, thereby driving up the costs and complexities in chip manufacturing. The migrations also are putting enormous stress on nearly all points of the fab flow, including a critical but unsung part of the business—process control. Process control involves 20 or so different segments in the inspection and metrology arena. Genera... » read more

Experts At The Table: Yield And Reliability Issues With Integrating IP

By Ed Sperling - 12 Dec, 2013 - Comments: 0

Semiconductor Engineering sat down to discuss the impact of integrating IP in complex SoCs with Juan Rey, senior director of engineering at Mentor Graphics; Kevin Yee, product marketing director for Cadence’s SoC Realization Group; and Mike Gianfagna, vice president of marketing at eSilicon. What follows are excerpts of that conversation. SE: As more pieces are integrated into complex SoCs... » read more

Let’s All Meet At The Via Bar!

By Jean-Marie Brunet - 30 Jun, 2013 - Comments: 0

By Jean-Marie Brunet At 28 nm and below, a variety of new design requirements are forcing us to adjust the traditional layout and verification process of digital designs. The use of vias, in particular, has been significantly impacted. New via types have been introduced, and the addition of double patterning, FinFETS, and other new design techniques has not only generated a considerable increa... » read more

Inside Leti’s Litho Lab

By Mark LaPedus - 16 May, 2013 - Comments: 0

By Mark LaPedus Semiconductor Manufacturing & Design sat down to discuss future lithography challenges with Serge Tedesco, lithography program manager at CEA-Leti; Laurent Pain, lithography lab manager at CEA-Leti; and Raluca Tiron, a senior scientist at CEA-Leti. SMD: CEA-Leti has two major and separate programs, including one in directed self-assembly (DSA) and another in multi-beam ... » read more

Reducing The Drama In DFM

By Ed Sperling - 24 Jan, 2013 - Comments: 0

By Ann Steffora Mutschler For reducing cycle time of DFM checks prior to manufacturing, pattern matching is a topic of great excitement as of the past few manufacturing nodes. The idea behind the technology is that there are certain patterns in the physical layout of the chip, which unless they are addressed, won’t come out right. That’s what causes the drama, observed Saleem Haider, se... » read more

LP Test Strategies

By Luke Lang - 13 Sep, 2012 - Comments: 0

By Luke Lang Power during test is one area that is often overlooked. In the worst (but easiest to diagnose) case, excessive test power can lead to a smoking chip on the tester. (You don’t need an engineering education to see the problem.) In a better (but more difficult to diagnose) case, excessive test power will cause reduced yield. Let’s look at what causes excessive test power and how ... » read more

Boosting Yield With Layout Awareness

By Ed Sperling - 26 Apr, 2012 - Comments: 0

By Ann Steffora Mutschler Yield. Just the word can make many engineers cringe and hide in their cubicles—especially with manufacturing problems and excessive power during test increasing causing failures. But the combination of physical data with diagnostics engines may be the light at the end of the tunnel, allowing for easier pinpointing of defects. There are many reasons why a chip fai... » read more

Experts At The Table: Improving Yield

By Ed Sperling - 07 Nov, 2011 - Comments: 0

By Ed Sperling Semiconductor Manufacturing & Design sat down to discuss yield issues with Sesh Ramaswami, senior director of strategy at Applied Materials; Luigi Capodieci, R&D fellow at GlobalFoundries; Kimon Michaels, vice president and DFM director at PDF Solutions; Mike Smayling, senior vice president at Tela Innovations; and Mark Mason, director of data integration at Texas Instr... » read more

Experts At The Table: Improving Yield

By Ed Sperling - 27 Oct, 2011 - Comments: 0

y Ed Sperling Semiconductor Manufacturing & Design sat down to discuss yield issues with Sesh Ramaswami, senior director of strategy at Applied Materials; Luigi Capodieci, R&D fellow at GlobalFoundries; Kimon Michaels, vice president and DFM director at PDF Solutions; Mike Smayling, senior vice president at Tela Innovations; and Mark Mason, director of data integration at Texas Instrum... » read more

Different Ways To Boost Yield

By Ed Sperling - 30 Jun, 2011 - Comments: 0

By Ann Steffora Mutschler In the race to get products to market with shortening product cycles, steepening the ramp to yield is critical. The introductory phase of a product is the point at which margins are highest and market share can be most easily gained. This is no surprise to chipmakers. What is surprising is just how much more difficult it has become to achieve acceptable yield quick... » read more

← Older posts Newer posts →

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: yield

Challenges Mount In Inspection And Metrology

Experts At The Table: Yield And Reliability Issues With Integrating IP

Let’s All Meet At The Via Bar!

Inside Leti’s Litho Lab

Reducing The Drama In DFM

LP Test Strategies

Boosting Yield With Layout Awareness

Experts At The Table: Improving Yield

Experts At The Table: Improving Yield

Different Ways To Boost Yield