Tech Talk: Power, Performance And Area In 2.5D

A look at the economics and the design challenges of continuing down Moore’s Law, and why 2.5D is so attractive in the long term.

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The cost will be comparable at first, but the only way to improve power, performance AND area at the same time will be with a different architectural approach.




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  • Dev Gupta

    ultimately 2.5d w/ multiple dice must cost no more than a single SoC w/ diverse functional blocks, this means that the additional cost of the Si Interposer or even a fine pitch ( 2 um L / S ) organic substrate along with the cost of assembly must be paid for by splitting a single SoC into parts ( i,e. savings from not filling up a 20 or 28 nm Fab to make blocks that could have been made in a say 45 nm Fab, plus yield improvement by splitting a huge die into smaller dice as in the Xilinx modules — the only 2.5 d to date ), also the propagation delays & losses through the interposer must not be any worse than on a single large chip. till then all these Design related prognostications are premature & irrelevant.