What can go wrong in complex SoCs and how to find the problems.
Bernie DeLay, group director for verification IP R&D at Synopsys, talks about what goes wrong in complex SoCs, how so-called standard pieces play together, and where are the gotchas in re-use.
Why packaging is becoming increasingly critical and difficult in the automotive market.
Most attacks in the past focused on gaining access to software, but Meltdown and Spectre have changed that forever.
Old problem is becoming more difficult to resolve at each new node; mitigation measures being developed.
Shortages of used equipment and lower margins mean this problem isn’t getting solved anytime soon.
5G is driving up demand for both 300mm and 200mm capacity. Both are in short supply.
Autonomous vehicles will cause fundamental shifts across a number of established industry segments tied to automotive, opening up big opportunities for chips and tools.
Better tools, more compute power, and more efficient algorithms are pushing this technology into the mainstream.
Goal is to improve quality while reducing time to revenue, but it’s not always so clear-cut.
But working with this architecture has some not-so-obvious pitfalls, and new tools licensing options may be necessary.
So far there are no tools and no clear methodology to eliminating bugs. That would require understanding what an AI bug actually is.
Part 1 of 2: How do you trade off cost and safety within an automobile? Plus, a look at some of the challenges the chip industry is facing.
The issues may be familiar, but they’re more difficult to solve and can affect everything from performance to yield.
When does a large amount of data become Big Data, and could system-level verification benefit from it?
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