How an incident angle optimization for optical wafer tests and a fully automatic SiPh wafer test architecture achieved accurate.
Implementing energy-efficient optical transceiver modules with silicon photonics (SiPh) and 3DIC technologies will help alleviate the increasing energy consumption for hyperscale data centers. To facilitate effective 3DIC heterogenous integration of these photonics integrated circuits for optical transceivers, high precision, repeatable and reliable SiPh wafer acceptance tests are essential and vital. This paper successfully demonstrated incident angle optimization for optical wafer tests as well as evaluation of a fully automatic SiPh wafer test architecture that is accurate and dependable, achieving excellent test correlations between passive and active devices designed with grating-couplers and edgecouplers.
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