Using internal data to determine failure rates and how close an individual device is to failure.
Reliability testing always has been a challenge for semiconductor companies, but it’s becoming much more difficult as devices continue to shrink, as they’re integrated together in advanced packages, and as they’re utilized under different conditions with life expectancy that varies by application and use case. Nir Sever, senior director of business development at proteanTecs, and Luca Moriconi, R&D and roadmap manager at ELES Semiconductor Equipment, talk with Semiconductor Engineering about extracting data from inside a device, using deep data and telemetry, in order to determine how close to failure a device is operating, what is the rate of failure, and why this has become necessary in addition to the traditional stress and structural testing approaches.
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