Deep learning center; new VC fund; tool billings.
Fab/mask manufacturing
An alliance of companies have formed the Center for Deep Learning in Electronics Manufacturing (CDLe). NuFlare, Mycronic and D2S have established the San Jose, Calif.-based center to advance the state-of-the-art in deep learning for its industry-specific applications.
Imec.xpand, an early-stage and growth fund that is initiated by Imec, has closed its first fund at 117 million euros in committed capital. The move positions Imec as a player in the venture capital arena.
Chipmakers
United Microelectronics Corp. (UMC) has announced that Dow Jones Sustainability Index (DJSI) has selected UMC as a global component for the 11th consecutive year.
Renesas has signed a definitive agreement to acquire Integrated Device Technology (IDT), a supplier of analog mixed-signal products including sensors, connectivity and wireless power chips. The deal represents a value of approximately $6.7 billion.
Intel acquired NetSpeed Systems, taking in network-on-a-chip and interconnect fabric intellectual property for designing, developing, and testing system-on-a-chip devices.
Packaging
ASE Technology Holding has been included in the 2018 Dow Jones Sustainability Indices (DJSI) World and Emerging Market segments.
Market research
Worldwide semiconductor manufacturing equipment billings reached $16.7 billion in the second quarter of 2018, 1% lower than the previous record quarter and 19% higher than the same quarter a year ago, according to SEMI.
Global semiconductor spending in 2018 is now expected to reach $473.8 billion and clock a growth rate of 15%, a significant upward revision from the 7.5% expansion (to $442.9 billion) forecast at the start of the year by six research and investment forecasts tracked by SEMI.
The market for microcontrollers is expected to continue hitting record-high annual revenues through 2022 after worldwide sales dropped 6% in 2016 because of a slowdown in MCU unit shipments, according to IC Insights.
Events
The 2018 IEEE S3S Conference will take place on Oct. 15-18 in Burlingame, Calif. The topics include 3D integration, low-power circuits, and SOI technology.
 |
 |
 |
 |
 |
 |
 |  |
Leave a Reply