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GaN Power Devices Power Up


Key Takeaways: GaN devices are gaining traction due to their ability to tolerate higher voltages. New approaches such as chiplets offer faster switching with less loss. The first applications to benefit from GaN will be low-voltage consumer devices; industrial applications require more work. As electrical power displaces fossil fuels in more applications, system designers ne... » read more

Silicon Photonics Lights The Way To More Efficient Data Centers


Key Takeaways Photonic interconnects potentially increase bandwidth density while significantly reducing power consumption. AI workloads are driving their adoption in data centers. On the other hand, photonic interconnects require a variety of different materials, introducing process compatibility and thermal and mechanical stress issues. Integrated electro-optical I/O modules are th... » read more

2D Semiconductors Inch Forward


Key Takeaways: Diffusing oxygen into 2D materials can improve adhesion properties. Channel-last processes can preserve most of the traditional gate-all-around process flow. Dual-gate MoS2 FETs with graphene contacts take advantage of layer transfer methods. Transition metal dichalcogenides (TMDs) have come a long way since exfoliated flakes were the state of the art, but the... » read more

Why Indium Oxide Chips Are Getting So Much Attention


Key Takeaways Their low leakage is of interest for memory applications, particularly capacitor-less gain cell designs; They can be deposited over large areas using low-temperature processes, a very desirable characteristic for BEOL integration, and The variety of compositions available gives designers many options to achieve the specific properties they need. Indium tin oxide (ITO), ... » read more

Oxides Bring Low Leakage Transistors To Leading-Edge Memories


AI workloads need to position more memory that uses less power in ever-closer proximity to computational logic. That overriding imperative is driving new memory designs and new materials exploration across a wide range of applications, including cache memory, working memory, as well as a new category, non-volatile memory used for direct computation. The largest of these, by volume, is workin... » read more

Benefits And Limits Of Using ML For Materials Discovery


Machine learning tools can accelerate all stages of materials discovery, from initial screening to process development. Whether the goal is to identify new applications for known materials or to design new molecules for a particular task, these tools help materials scientists find correlations in large data libraries. Still, machine learning tools are not magic. “Software tools are only as... » read more

Machine Learning Tools Accelerate Materials Discovery


Literature searches, simulations, and practical experiments have been part of the materials science toolkit for decades, but the last few years have seen an explosion of machine learning-driven software tools that promise to accelerate all three. Many of the challenges facing the semiconductor manufacturing industry are fundamentally materials science problems. What metal has the lowest resi... » read more

Why In-Memory Computation Is So Important For Edge AI


In popular media, “AI” usually means large language models running in expensive, power-hungry data centers. For many applications, though, smaller models running on local hardware are a much better fit. Autonomous vehicles need to respond in real-time, without data transmission delays. Medical and industrial applications often depend on sensitive data that cannot be shared with third par... » read more

Scaling Memory With Molybdenum


Molybdenum is looking increasingly promising as a replacement for a variety of metals commonly used in semiconductor manufacturing today, especially at leading-edge nodes. One by one, chipmakers are crossing metals off the list at advanced nodes. While ruthenium liners are nearly ready for production, the metal is not ready to replace copper in highly scaled interconnects. Ruthenium is very ... » read more

The End Of Copper Interconnects?


After nearly three decades, the era of copper interconnects may be coming to an end. Sort of. At interconnect CDs below 10nm, copper is no longer the best metallization choice. Yet it remains unsurpassed for larger features. The most serious challenge to continued copper scaling is the metal’s dramatic increase in resistivity at dimensions below its relatively large (40nm) mean free path l... » read more

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