Blog Review: June 24

Injectable electronics; seven DAC takeaways; Dead Sea cubes; academia and industry; automotive security; engineering and Machu Picchu; IoT explosion.

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Rambus’ Aharon Etengoff reports on a new development enabling a needle measuring just a few millimeters in length to inject mesh electronics directly into the brain, and the medical possibilities of injectable electronics.

ARM’s Eoin McCann presents seven topics getting a lot of air time both in the booths and in speeches, presentations and panel discussions at DAC.

Synopsys’ Michael Posner discusses the design, verification and validation process when team members are separated across the globe, and takes a journey in search of the Dead Sea’s famed salt cubes.

Could collaboration between academia and industry revitalize EDA? Cadence’s Richard Goering reports from a presentation at DAC.

Mentor’s John Day looks at the importance of over-the-air updates in automotive security.

On a once-in-a-lifetime trip to Machu Picchu, Ansys’ Tom Smithyman found some unexpected engineering lessons in the ruins of the Peruvian city.

At the end of 2014, Gartner stated that there could be as many as 4.9 billion connected ‘things’ in use this year alone. NXP’s Denis Noel addresses ways to trust the security of devices we use, the networks they connect to and other devices that they interact with.

Check out the blogs featured in last week’s Manufacturing, Design & Test newsletter:

Editor In Chief Ed Sperling argues that from the big picture standpoint, there are side benefits to all research.

Executive Editor Mark LaPedus doesn’t believe a mega-merger will occur in the fab tool sector anytime soon.

Mentor Graphics’ David Abercrombie uncorks part one on the limits of tools in finFET-based SoCs.

Applied Materials’ Max McDaniel contends it’s just a matter of time before we’re rolling our own devices like newspapers.

SEMI’s Osamu Nakamura takes a look at how Japan’s semiconductor industry has changed.

Semico Research’s Adrienne Downey crunches some numbers and finds total expenditures will hit $68B this year, with Samsung on top followed by Intel and TSMC.

NuFlare’s Noriaki Nakayamada looks at the past, present and future in conquering heat issues in e-beam lithography.