Gaps In Metrology Could Impact Yield

For some time, chipmakers have been developing new and complex chip architectures, such as 3D NAND, finFETs and stacked die. But manufacturing these types of chips is no simple task. It requires a robust fab flow to enable new IC designs with good yields. In fact, yield is becoming a more critical part of the flow. Yield is a broad term that means different things to different parts of the ... » read more