The Week In Review: Manufacturing


South Korea’s SK Hynix led the initial charge in the development of High Bandwidth Memory (HBM), a 3D DRAM technology based on a memory stack and through-silicon vias (TSVs). SK Hynix has been shipping HBM parts in the market. Now, SK Hynix and Samsung are readying the next version of the technology, dubbed High Bandwidth Memory 2 or HMB2, according to a report from The Electronic Times of So... » read more

The Week In Review: Manufacturing


Intel announced plans to invest up to $1.6 billion in the next 15 years to upgrade its Chengdu, China factory for die prep, assembly and test operations, as well as to bring Intel’s latest Advanced Test Technology to China. Advanced Test Technology is Intel’s internal ATE capabilities. “It is also the single biggest investment by Intel in Chengdu,” said William Holt, executive vice pres... » read more