Can Startups Solve Today’s Automotive Challenges?


When asked about the most pressing concerns today amongst automotive customers, some leading industry suppliers had the following to say: Samer Hijazi, senior design engineering architect, IP Group at Cadence: How fast can I deploy? Ron DiGiuseppe, Senior Strategic Marketing Manager at Synopsys: Our customers are very broadly requiring ISO26262 safety compliance in our products as well a... » read more

The Week In Review: IoT


Security Last month’s distributed denial-of-service cyberattacks have put the spotlight on poorly secured or insecure Internet of Things devices. "The harsh reality is that cybersecurity is not even on the radar of many manufacturers," said Trent Telford, CEO of Covata, an Internet security firm. "Security will eventually become more of a priority, but it may well be too late for this genera... » read more

Will 5G Enable Connected Cars?


As the telecom, automotive and semiconductor ecosystems rally to develop solutions for next-generation mobile networks for the connected car, 5G technology has emerged as a strong contender. Fifth-generation mobile networks will enable data transmission rates of more than 10Gps, connecting machines to machines, as well as everything else, including smartphones, IoT devices that require a... » read more

Smartphone Security: For Your Eyes Only


Fans of the Olympics here in the United States were treated to a great Samsung commercial throughout the broadcast. The commercial stars the genius, multi-award-winning actor Christoph Waltz, showing how Americans can multitask with the amazing new Galaxy Note7. Yes, THAT Galaxy Note7. The 90-second long commercial is a delight to watch, but it must have cost Samsung some serious bucks to produ... » read more

Packaging Wars Begin


The advanced IC-packaging market is turning into a high-stakes competitive battleground, as vendors ramp up the next wave of [getkc id="82" kc_name="2.5D"]/[getkc id="42" kc_name="3D"] technologies, high-density fan-out packages and others. At one time, the outsourced semiconductor assembly and test ([getkc id="83" comment="OSAT"]) vendors dominated and handled the chip-packaging requirement... » read more

The Week In Review: Manufacturing


Chipmakers At this week’s Flash Memory Summit, Samsung rolled out several new products, including its next-generation 3D NAND device and a solid-state drive (SSD) with capacities up to 32 terabytes. At the same time, Samsung introduced a new and high-performance SSD solution, dubbed the Z-SSD. Samsung’s Z-SSD shares the fundamental structure of V-NAND and has a unique circuit design and... » read more

The Week in Review: IoT


Networks The Netherlands and South Korea are both laying claim to installing the first nationwide Internet of Things networks in the world. In the Netherlands, KPN has connected the country with a low-power, wide-area network optimized for IoT. SK Telecom is serving Korea with coast-to-coast IoT coverage, and the Korean carrier plans to spend up to $86.8 million through the end of 2017 on upg... » read more

Designing SoCs For Hybrids


Hybrid vehicle sales are growing, driven by a global concern for lower vehicle emissions and consumer demand for better economy. This has set off a rush by semiconductor companies to provide key components for those vehicles because they are much more reliant on electronics than regular gasoline-powered vehicles. But the changeover is not as straightforward as it might sound. Hybrid vehicles... » read more

Foundries Expand Planar Efforts


Competition is heating up in the leading-edge foundry business, as vendors begin to ramp up their new 16nm/14nm finFET processes. But that’s not the only action in the foundry arena. They are also expanding their efforts in the leading-edge planar market by rolling out new 28nm and 22nm processes. On one front, TSMC is offering new 28nm variants, based on bulk CMOS technology. And on an... » read more

What’s Different At 16/14nm?


Will finFETs live up to their promise? It depends on whom you ask, when you ask that question, and the intended application of a design. But across the semiconductor industry, there is general agreement that it's getting easier to work at the most advanced nodes as tools and flows are better understood and overall experience increases. There is no question that [getkc id="185" kc_name="finFE... » read more

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