OSAT Biz: Growth And Challenges


Amid a challenging business environment, the outsourced semiconductor assembly and test (OSAT) industry is projected to see steady to strong growth in a number of packaging segments this year. Right now, the [getkc id="83" kc_name="OSATs"]—which provide third-party IC-packaging and test services—are seeing brisk demand for both legacy and advanced chip packages. In addition, IDMs continu... » read more

The Week In Review: IoT


Finance Ring, which sells Internet-connected doorbells, security cameras, and other products, received another $109 million in private funding, bringing its total funding to $209 million. DFJ Growth, Goldman Sachs Investment Partners, and Qualcomm Ventures led the Series D round, with participation by Richard Branson and other existing investors. Ring says its products are available in 100 cou... » read more

The Week In Review: IoT


Products Qualcomm reported before the official opening of CES 2017 that it has shipped more than 1 billion Internet of Things chips to date, for such applications as automotive electronics, Internet-connected televisions, sensors, and wearable gadgets (including smartwatches). The company didn’t include chips for smartphones and tablet computers in that total. “We have scale,” said Raj T... » read more

Looking Back On IoT In 2016


The Internet of Things was going great guns for most of 2016. Until October 21, that is. That’s the date of the coordinated cyberattacks on Dyn, an Internet performance management services firm. The distributed denial-of-service attacks quickly had impacts on Airbnb, Amazon, Facebook, Netflix, PayPal, Reddit, Twitter, and other popular websites. Dyn was able to fight off the aggressive att... » read more

The Week In Review: IoT


Analysis Some consumer IoT products are actually useful and helpful in daily life, such as the Nest Learning Thermostat and the Honeywell Lyric for home automation, David Pogue writes. Then there are the products that make most people scratch their heads – IoT water bottles, the IoT toilet-paper dispenser, the IoT toothbrush, IoT umbrella, IoT fork, the IoT egg tray, and so on, he notes. “... » read more

Can Startups Solve Today’s Automotive Challenges?


When asked about the most pressing concerns today amongst automotive customers, some leading industry suppliers had the following to say: Samer Hijazi, senior design engineering architect, IP Group at Cadence: How fast can I deploy? Ron DiGiuseppe, Senior Strategic Marketing Manager at Synopsys: Our customers are very broadly requiring ISO26262 safety compliance in our products as well a... » read more

The Week In Review: IoT


Security Last month’s distributed denial-of-service cyberattacks have put the spotlight on poorly secured or insecure Internet of Things devices. "The harsh reality is that cybersecurity is not even on the radar of many manufacturers," said Trent Telford, CEO of Covata, an Internet security firm. "Security will eventually become more of a priority, but it may well be too late for this genera... » read more

Will 5G Enable Connected Cars?


As the telecom, automotive and semiconductor ecosystems rally to develop solutions for next-generation mobile networks for the connected car, 5G technology has emerged as a strong contender. Fifth-generation mobile networks will enable data transmission rates of more than 10Gps, connecting machines to machines, as well as everything else, including smartphones, IoT devices that require a... » read more

Smartphone Security: For Your Eyes Only


Fans of the Olympics here in the United States were treated to a great Samsung commercial throughout the broadcast. The commercial stars the genius, multi-award-winning actor Christoph Waltz, showing how Americans can multitask with the amazing new Galaxy Note7. Yes, THAT Galaxy Note7. The 90-second long commercial is a delight to watch, but it must have cost Samsung some serious bucks to produ... » read more

Packaging Wars Begin


The advanced IC-packaging market is turning into a high-stakes competitive battleground, as vendors ramp up the next wave of [getkc id="82" kc_name="2.5D"]/[getkc id="42" kc_name="3D"] technologies, high-density fan-out packages and others. At one time, the outsourced semiconductor assembly and test ([getkc id="83" comment="OSAT"]) vendors dominated and handled the chip-packaging requirement... » read more

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