tag: models

System State Challenges Widen
By Brian Bailey - 30 Nov, 2023 - Comments: 0

Knowing the state of a system is essential for many analysis and debug tasks, but it's becoming more difficult in heterogeneous systems that are crammed with an increasing array of features. There is a limit as to how many things engineers can keep track of, and the complexity of today's systems extends far beyond that. Hierarchy and abstraction are used to help focus on the important aspect... » read more

The Limits Of AI-Generated Models
By Brian Bailey - 26 Oct, 2023 - Comments: 2

In several recent stories, the subject of models has come up, and one recurrent theme is that AI may be able to help us generate models of a required abstraction. While this may be true in some cases, it is very dangerous in others. If we generalize, AI should be good for any model where the results are predominantly continuous, but discontinuities create problems. Unless those are found and... » read more

Anatomy Of A System Simulation
By Brian Bailey - 26 Oct, 2023 - Comments: 0

The semiconductor industry has greatly simplified analysis by consolidating around a small number of models and abstractions, but that capability is breaking down both at the implementation level and at the system level. Today, the biggest pressure is coming from the systems industry, where the electronic content is a small fraction of what must be integrated together. Systems companies tend... » read more

The Federation Needs A Taxonomy
By Brian Bailey - 28 Sep, 2023 - Comments: 0

While putting together the story about federated simulation, it brought back memories of an earlier part of my career when I spent a lot of time looking at modeling abstractions and simulation frameworks. In the mid-1990s, the notions of re-using pre-designed blocks of IP started to become popular, but the fledgling industry was in disarray. Every IP block had a different set of deliverables... » read more

Industry Pressure Grows For Simulating Systems Of Systems
By Brian Bailey - 28 Sep, 2023 - Comments: 0

Most complex systems are designed in a top-down manner, but as the amount of electronic content in those systems increases, so does the pressure on the chip industry to provide high-level models and simulation capabilities. Those models either do not exist today, or they exist in isolation. No matter how capable a model or simulator, there never will be one that can do it all. In some cases,... » read more

Improving Chip Efficiency, Reliability, And Adaptability
By Ed Sperling - 08 Dec, 2022 - Comments: 0

Peter Schneider, director of Fraunhofer Institute for Integrated Circuits' Engineering of Adaptive Systems Division, sat down with Semiconductor Engineering to talk about new models and approaches for ensuring the integrity and responsiveness of systems, and how this can be done within a given power budget and at various speeds. What follows are excerpts of that conversation. SE: Where are y... » read more

Simplifying AI Edge Deployment
By Ed Sperling - 10 Oct, 2022 - Comments: 0

Barrie Mullins, vice president of product at Flex Logix, explains how a programmable accelerator chip can simplify semiconductor design at the edge, where chips need to be high performance as well as low power, yet developing everything from scratch is too expensive and time-consuming. Programmability allows these systems to stay current with changes in algorithms, which can affect everything f... » read more

Distilling The Essence Of Four DAC Keynotes
By Brian Bailey - 28 Jul, 2022 - Comments: 0

Chip design and verification are facing a growing number of challenges. How they will be solved — particularly with the addition of machine learning — is a major question for the EDA industry, and it was a common theme among four keynote speakers at this month's Design Automation Conference. DAC has returned as a live event, and this year's keynotes involved the leaders of a systems comp... » read more

Setting Ground Rules For 3D-IC Designs
By Ed Sperling - 12 Jan, 2022 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss the changes in design tools and methodologies needed for 3D-ICs, with Sooyong Kim, director and product specialist for 3D-IC at Ansys; Kenneth Larsen, product marketing director at Synopsys; Tony Mastroianni, advanced packaging solutions director at Siemens EDA; and Vinay Patwardhan, product management group director at Cadence... » read more

Revving Up SiC And GaN
By Ann Mutschler - 13 Dec, 2021 - Comments: 0

Silicon carbide (SiC) and gallium nitride (GaN) are becoming more popular for power electronics, particularly in automotive applications, driving down costs as volumes scale up and increasing the demand for better tools to design, verify, and test these wide-bandgap devices. Both SiC and GaN are proving essential in areas such as battery management in electric vehicles. They can handle much ... » read more

← Older posts

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2024 SMG   |  Terms of Service  |  Privacy Policy