Can We Measure Next-Gen FinFETs?


After ramping up their respective 16nm/14nm finFET processes, chipmakers are moving towards 10nm and/or 7nm, with 5nm in R&D. But as they move down the process roadmap, they will face a new set of fab challenges. In addition to lithography and interconnects, there is metrology. Metrology, the science of measurements, is used to characterize tiny films and structures. It helps to boost yi... » read more

Software Platforms Bridge The Design/Verification Gap For 5G Communications Design


We are entering the third phase of information connectivity, one that will change the use of wireless technology dramatically. The first phase connected homes and businesses through wired telephony and the early internet via dial-up modems. Over the last few decades, the development of communication networks has been superseded by wireless mobile technology connecting people instead of places. ... » read more

A Product Development Flow For 5G/LTE Envelope Tracking Power Amplifiers


Next-generation communication systems will rely on system architectures that will challenge component level design. This NI AWR software white paper examines the use of envelope tracking (ET), digital pre-distortion, and impedance matching via load pull to improve the efficiency and linearity performance of RF PAs targeting 4G and 5G applications. To read more, click here. » read more

Oscilloscopes: The EE’s Stethoscope


Oscilloscopes are like the electricity to your house. You don't give it much thought until a storm knocks it out. The entire electronics industry can't function without oscilloscopes. But this equipment is such a constant and so consistent, we sometimes forget it's there. Semiconductor Engineering spent time with three Test & Measurement (T&M) industry stalwarts to talk about Oscillo... » read more

The Week In Review: Manufacturing


Samsung Austin Semiconductor plans to invest more than $1 billion in its fab in Austin, Texas. Today, the fab continues to ramp up the company’s 14nm finFET technology. At the same time, Samsung is expanding its advanced finFET foundry process technology offerings with its fourth-generation 14nm process (14LPU) and its third-generation 10nm technology (10LPU). Graphcore is developing a so-... » read more

The Week In Review: Manufacturing


Chipmakers As expected, Qualcomm has signed a definitive agreement to acquire NXP. The value of the deal is approximately $47 billion. With the deal, Qualcomm is diversifying from a maturing handset market into the growing automotive, IoT and security sectors, according to Genuity semiconductor analyst Matthew Ramsay, in a recent research note. “Automotive infotainment, ADAS, IoT and ot... » read more

What To Do With A GaN PDK


Wolfspeed's Jeremy Fisher provides a hands on demo of how his group achieved a first-pass run of a 40GHz MMIC chip using using a PDK for its 0.14 micron process. [youtube vid=i7dsQG8CTO4] » read more

Testing the Big Bang of Smart Devices


Thanks to the proliferation of smart devices in the Internet of Things (IoT), it’s a circumstance not unlike the overwhelming sense of wonder and bewilderment that ancient Greek astronomer Ptolemy must have felt when gazing up at a sky full of stars on a clear winter’s night, trying to rationalize the vast tableau before him. But just as we wouldn’t critique early astronomers and philo... » read more

The Week In Review: Manufacturing


Fab tools and materials After a series of delays due to regulatory issues, Lam Research and KLA-Tencor have agreed to terminate their proposed merger agreement. Amid a possible proxy battle, Kulicke & Soffa Industries has named Fusen Chen as president and chief executive, effective Oct. 31. He was also elected to the board of K&S. Jonathan Chou, chief financial officer and interim CEO, w... » read more

The Week In Review: Manufacturing


Chipmakers In 2016, growth in the pure-play foundry business will be driven by leading-edge processes, according to IC Insights. In fact, the increase in pure-play foundry sales this year is forecast to be almost entirely due to processes at » read more

← Older posts