The Week In Review: Manufacturing


Chipmakers IC Insights has released its rankings of the top 10 pure-play foundries in 2016. TSMC was the largest foundry in terms of sales, followed by GlobalFoundries, UMC, and SMIC, according to IC Insights. TSMC held a 59% share in 2016. According to IC Insights, the three top-10 pure-play foundry companies that displayed the highest growth rates in 2016 were X-Fab (54%), SMIC (31%) and To... » read more

The Week In Review: IoT


R&D National Instruments this week opened the NI Industrial Internet of Things Lab at its headquarters in Austin, Texas. NI and Real-Time Innovations are co-leading the Industrial Internet Consortium’s Industrial Internet of Things Microgrid Testbed, which will be hosted at the NI Industrial Internet of Things Lab. The testbed uses the Data Distribution Service standard and is working to dev... » read more

The Week In Review: Manufacturing


Chipmakers and OEMs Samsung NEXT, formerly called the Samsung Global Innovation Center, has announced the creation of the Samsung NEXT Fund, a $150 million venture capital investment fund. The idea is to fund early stage startups. What’s next in consumer electronics? At CES 2017, Samsung unveiled a wide range of new products, such as quantum dot TVs, smart appliances, gaming laptops and s... » read more

The Week In Review: Manufacturing


Chipmakers TDK has agreed to acquire MEMS supplier InvenSense for cash at an acquisition price of $13.00 per share, for a total acquisition price of $1.3 billion. Cypress has begun volume shipments of microcontrollers (MCUs) based on its 40nm Embedded Charge-Trap (eCT) flash technology. The MCUs are made on a foundry basis at UMC. UMC’s technology is a 40nm low power (40LP) logic process.... » read more

Software Platforms Bridge The Design/Verification Gap For 5G Communications Design


The integration of simulation technologies, system prototyping tools, and automated test equipment is critical for addressing the complexity of developing 5G wireless technology. In these cases, design teams will need to rely on a combination of simulation and prototype testing in order to ensure design robustness. Although simulation is essential to design a test bed or prototype, measurement... » read more

Fab Tool Biz Faces Challenges In 2017


After experiencing a gradual recovery and positive growth in 2016, the semiconductor equipment industry sees a mixed picture as well as some uncertainty in 2017. In the near term, though, business is robust. Several chipmakers started to place a sizeable number of fab tool orders in the latter part of 2016, particularly in three areas—3D NAND, logic and foundry. Now, after buying the in... » read more

When Exposed To IoT, Big Iron ATE Will Rust


When the first “smart” refrigerators were released in the early 2000s, consumers weren’t sure what to do with them. When Nest released the smart thermostat, though, a revolution happened. Humans were taken out of the loop because the thermostat learned on its own about desired temperature and how quickly it could cool or heat a house. And it could synchronize all of this better than a hum... » read more

Can We Measure Next-Gen FinFETs?


After ramping up their respective 16nm/14nm finFET processes, chipmakers are moving towards 10nm and/or 7nm, with 5nm in R&D. But as they move down the process roadmap, they will face a new set of fab challenges. In addition to lithography and interconnects, there is metrology. Metrology, the science of measurements, is used to characterize tiny films and structures. It helps to boost yi... » read more

Software Platforms Bridge The Design/Verification Gap For 5G Communications Design


We are entering the third phase of information connectivity, one that will change the use of wireless technology dramatically. The first phase connected homes and businesses through wired telephony and the early internet via dial-up modems. Over the last few decades, the development of communication networks has been superseded by wireless mobile technology connecting people instead of places. ... » read more

A Product Development Flow For 5G/LTE Envelope Tracking Power Amplifiers


Next-generation communication systems will rely on system architectures that will challenge component level design. This NI AWR software white paper examines the use of envelope tracking (ET), digital pre-distortion, and impedance matching via load pull to improve the efficiency and linearity performance of RF PAs targeting 4G and 5G applications. To read more, click here. » read more

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