Security Issues Up With Heterogeneity


The race toward heterogeneous designs is raising new security concerns across the semiconductor supply chain. There is more IP to track, more potential for unexpected interactions, and many more ways to steal data or IP. Security is a difficult problem no matter what kind of chip is involved, and it has been getting worse as more devices, machines and systems are connected to the Internet. B... » read more

Biz Talk: ASICs


eSilicon CEO [getperson id="11145" comment="Jack Harding"] talks about the future of scaling, advanced packaging, the next big things—automotive, deep learning and virtual reality—and the need for security. [youtube vid=leO8gABABqk]   Related Stories Executive Insight: Jack Harding (Aug 2016) eSilicon’s CEO looks at industry consolidation, competition, China’s impact, an... » read more

Border Tax Shakeup


A border tax is the talk of the financial world. While this has clear implications for car manufacturers, where it's rather easy to tell where parts such an engine block or a braking system were manufactured, it's far less tangible when it comes to electronics in general, and semiconductors in particular. In a complex SoC, IP can be developed in more than one country, and multinational techn... » read more

Harder Than It Looks


First Apple scales back plans to develop its own vehicle. Then Intel creates its own automotive chip unit. This kind of two-step movement in the automotive electronics industry is becoming more common. NXP buys Freescale, then Qualcomm buys NXP. Harman buys Symphony Teleca and Red Bend Software, then Samsung buys Harman. All of these moves are proof points that innovation and fleet-foo... » read more

Politics And (Low) Power


This week the entire semiconductor market woke up with a severe political hangover. Aside from the initial shock of the election results themselves, the winning platform of "America First" could have far-reaching implications for an industry that has spent decades optimizing a global supply chain the way it has finely tuned other processes to reduce the cost per transistor. There are many un... » read more

2.5D Becomes A Reality


Semiconductor Engineering sat down to discuss 2.5D and advanced packaging with Max Min, senior technical manager at [getentity id="22865" e_name="Samsung"]; Rob Aitken, an [getentity id="22186" comment="ARM"] fellow; John Shin, vice president at [getentity id="22903" e_name="Marvell"]; Bill Isaacson, director of ASIC marketing at [getentity id="22242" e_name="eSilicon"]; Frank Ferro, senior di... » read more

Tech Talk: 2.5D Issues


Bill Isaacson, director of ASIC marketing at eSilicon, about how viable this packaging approach is, organic vs. inorganic interposers, where the problems are, thermal coupling, interposer cost, and what will change over the next couple years. » read more

The Challenge Of Fitting In


Connections between players in the semiconductor industry are becoming critical for survival. Whether the focus is a connected car, home automation, health care or the energy grid, each company in each of those markets relies on others to build useful products. There are several forces at work here. One is an emphasis on connecting everything, regardless of whether it is inside a single vert... » read more

The Times They Are A-Changin’


Let me start out by saying that I’m not a huge Bob Dylan fan. I’m an American that grew up in the 1960s, so it’s hard to not call some of Dylan’s catalog a soundtrack for your life. The song that I used to title this blog has some special relevance for me and eSilicon. Recently, we’ve heard a lot about changing times, and not-so-good times, when it comes to the worldwide economy and o... » read more

Electronic Gas Concerns On The Rise


In the grand scheme of the semiconductor supply chain, electronic gases are something most engineers and scientists never think about. Behind the gleaming machinery and brightly labeled tubes, however, these gases allow wafers to be etched, kept at optimum temperatures, and prepared for the application of thin films. Electronic gases are remarkably well managed in high-volume fabs, which is ... » read more

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