Establish A Software Procurement Process To Manage Supply Chain Risk


Improving the procurement language in your software contracts is an effective way to convey requirements for built-in security. Too many examples of afterthought bolt-on security have put enterprises and users at risk due to exploitable software. Historically, there has been no shared liability associated with software because standard contracts have absolved software suppliers and outsource... » read more

Can A Supply Chain Be Too Efficient?


The semiconductor industry is a model of efficiency—literally. When other industries look at adding smart manufacturing into their operations, they often look to chip manufacturing as a shining example. After decades of business gyrations, semiconductor companies have figured out how to instill efficiency into every aspect of making chips. This is evident in device scaling. At 90nm, the co... » read more

Tracking Down Errors With Data


Michael Schuldenfrei, CTO at [getentity id="22929" comment="Optimal+"], sat down with Semiconductor Engineering to discuss how data will be used and secured in the future, the accuracy of that data, and what impact it can have on manufacturing. What follows are excerpts of that conversation. SE: Can data be shared across the supply chain? Schuldenfrei: We believe it has to happen. If it d... » read more

Security Issues Up With Heterogeneity


The race toward heterogeneous designs is raising new security concerns across the semiconductor supply chain. There is more IP to track, more potential for unexpected interactions, and many more ways to steal data or IP. Security is a difficult problem no matter what kind of chip is involved, and it has been getting worse as more devices, machines and systems are connected to the Internet. B... » read more

Biz Talk: ASICs


eSilicon CEO [getperson id="11145" comment="Jack Harding"] talks about the future of scaling, advanced packaging, the next big things—automotive, deep learning and virtual reality—and the need for security. [youtube vid=leO8gABABqk]   Related Stories Executive Insight: Jack Harding (Aug 2016) eSilicon’s CEO looks at industry consolidation, competition, China’s impact, an... » read more

Border Tax Shakeup


A border tax is the talk of the financial world. While this has clear implications for car manufacturers, where it's rather easy to tell where parts such an engine block or a braking system were manufactured, it's far less tangible when it comes to electronics in general, and semiconductors in particular. In a complex SoC, IP can be developed in more than one country, and multinational techn... » read more

Harder Than It Looks


First Apple scales back plans to develop its own vehicle. Then Intel creates its own automotive chip unit. This kind of two-step movement in the automotive electronics industry is becoming more common. NXP buys Freescale, then Qualcomm buys NXP. Harman buys Symphony Teleca and Red Bend Software, then Samsung buys Harman. All of these moves are proof points that innovation and fleet-foo... » read more

Politics And (Low) Power


This week the entire semiconductor market woke up with a severe political hangover. Aside from the initial shock of the election results themselves, the winning platform of "America First" could have far-reaching implications for an industry that has spent decades optimizing a global supply chain the way it has finely tuned other processes to reduce the cost per transistor. There are many un... » read more

2.5D Becomes A Reality


Semiconductor Engineering sat down to discuss 2.5D and advanced packaging with Max Min, senior technical manager at [getentity id="22865" e_name="Samsung"]; Rob Aitken, an [getentity id="22186" comment="ARM"] fellow; John Shin, vice president at [getentity id="22903" e_name="Marvell"]; Bill Isaacson, director of ASIC marketing at [getentity id="22242" e_name="eSilicon"]; Frank Ferro, senior di... » read more

Tech Talk: 2.5D Issues


Bill Isaacson, director of ASIC marketing at eSilicon, about how viable this packaging approach is, organic vs. inorganic interposers, where the problems are, thermal coupling, interposer cost, and what will change over the next couple years. » read more

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