System Bits: July 23


Superconductivity seen in trilayer graphene Stanford University and University of California at Berkeley researchers discovered signs of superconductivity in stacking three-layer sheets of graphene, they report. “It’s definitely an exciting development,” says Cory Dean, a physicist at Columbia University. Dean notes that bilayer graphene superconducts only when the atomic lattices of ... » read more

X-ray Detects Hidden Failure Modes


Functional testing and visual examination using stereo microscopy are today's 'standard' quality control techniques for characterising yield and workmanship-related issues in IC fabrication and electronics assembly. Currently used test methodologies—such as IPC-TM-650—rely heavily on visual examination. The visual detection of defects can still be difficult, as samples need to be inspected ... » read more

3D NAND Metrology Challenges Growing


3D NAND vendors face several challenges to scale their devices to the next level, but one manufacturing technology stands out as much more difficult at each turn—metrology. Metrology, the art of measuring and characterizing structures, is used to pinpoint problems and ensure yields for all chip types. In the case of 3D NAND, the metrology tools are becoming more expensive at each iteration... » read more

Manufacturing Bits: May 23


Pushing optical metrology The University of Illinois at Urbana-Champaign has developed a new way to determine crystal types using optical metrology techniques. Using an optical-based technique called absorption spectroscopy, researchers have detected tiny nanocrystals down to about 2nm resolutions. Absorption spectroscopy measures the absorption of radiation. It is measured as a function o... » read more

Manufacturing Bits: Oct. 18


Measuring gooey materials The National Institute of Standards and Technology (NIST) and Thermo Fisher Scientific have devised an instrument that correlates the flow properties of “soft gooey” materials, such as gels, molten polymers and biological fluids. The instrument, called a rheo-Raman microscope, combines three instruments into one system. First, the system incorporates a Raman sp... » read more

Manufacturing Bits: May 24


Microbunching EUV Researchers at the SLAC National Accelerator Laboratory have provided a status report on its ongoing efforts to develop a steady-state microbunching (SSMB) technology. SSMB is a technology used within a storage ring, which is a large-scale, circular particle accelerator. An SSMB mechanism produces a high-power radiation source within the ring. This, in turn, could enable a... » read more

Manufacturing Bits: April 5


Food in 3D Using a technology called ptychographic X-ray computed tomography, the University of Copenhagen and the Paul Scherrer Institute have taken images of food in three dimensions and on a nanometer scale. Ptychography, a lensless coherent imaging technique, could potentially save the food industry money. It could reduce food waste due to faulty production methods. Ptychography could ... » read more

Inside Inspection And Metrology


Semiconductor Engineering sat down to talk about inspection, metrology and other issues with Mehdi Vaez-Iravani, vice president of advanced imaging technologies at Applied Materials. What follows are excerpts of that conversation. SE: Today, the industry is working on a new range of complex architectures, such as 3D NAND and finFETs. For these technologies, the industry is clearly struggling... » read more

Inside X-ray Metrology


Chipmakers are ramping up a new class of chip architectures, such as 3D NAND and finFETs. Measuring and characterizing the tiny structures in these technologies is a major challenge. It will not only take the traditional metrology tools, but also various X-ray techniques. To get a handle on X-ray metrology, Semiconductor Engineering recently discussed the trends with the following experts: ... » read more

Manufacturing Bits: Sept. 15


Lasersabers and laser swords In 2013, the California Institute of Technology, Harvard and the Massachusetts Institute of Technology (MIT) found a way to bind two photons, thereby forming photonic molecules. To accomplish this feat, Caltech, Harvard and MIT pumped rubidium atoms into a vacuum chamber. They used lasers to cool the atoms. Then, they fired photons into a cloud of atoms. This, ... » read more

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