A technical paper titled “On Legalization of Die Bonding Bumps and Pads for 3D ICs” was published by researchers at the Georgia Institute of Technology, NVIDIA Corporation, and the University of Bremen.
Abstract
“State-of-the-art 3D IC Place-and-Route flows were designed with older technology nodes and aggressive bonding pitch assumptions. As a result, these flows fail to honor the width and spacing rules for the 3D vias with realistic pitch values. We propose a critical new 3D via legalization stage during routing to reduce such violations. A force-based solver and bipartite-matching algorithm with Bayesian optimization are presented as viable legalizers and are compatible with various process nodes, bonding technologies, and partitioning types. With the modified 3D routing, we reduce the 3D via violations by more than 10× with zero impact on performance, power, or area.”
Find the technical paper here. Published: March 2023
Pentapati, Sai, Anthony Agnesina, Moritz Brunion, Yen-Hsiang Huang, and Sung Kyu Lim. “On Legalization of Die Bonding Bumps and Pads for 3D ICs.” In Proceedings of the 2023 International Symposium on Physical Design, pp. 62-70. 2023.
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