Author's Latest Posts


Productivity And The IoT


The market for devices that connect almost everything to the [getkc id="76" comment="Internet of Things"] is projected to explode, creating opportunities for companies that haven’t been traditional chip developers to decide to start developing devices. Semiconductor Engineering sat down to discuss this topic with Jack Guedj, corporate VP of [getentity id="22342" comment="Tensilica"] products ... » read more

System Bits: Jan. 13


Quantum computational circuits MIT researchers have built an array of light detectors sensitive enough to register the arrival of photons and mounted them on a silicon optical chip, which could be critical components of quantum computing devices. They pointed out that single-photon detectors are notoriously temperamental. For example, of 100 deposited on a chip using standard manufacturing ... » read more

Power/Performance Bits: Jan. 13


Glass instead of crystals Since today's lithium-ion batteries are not good enough if our future energy system is to rely on electrical power, researchers around the world are continually looking to improve capacity and energy density. To this end, ETH Zurich researchers have developed a type of glass that can be used as an electrode material in lithium-ion batteries. ETH researchers discove... » read more

Americans Are Concerned About Privacy, Security, But Will Still Adopt It


As I wrote in my last blog post I have some concerns about the security and privacy aspects of some aspects of applications in the Internet of Things, and it seems I am not alone. According to NXP Semiconductors, which announced this week the findings of an IoT study it had Harris Poll conduct, 81% of respondents are concerned about their privacy and that this concern impacts their decision ... » read more

System Bits: Jan. 6


Quantum channel of light In experiments using ultracold atoms and laser light, ETH researchers have measured a stepwise change in conductivity as the atoms pass through tiny structures. This is the first time that this quantum effect has been observed for electrically neutral particles. [caption id="attachment_16993" align="alignnone" width="300"] A point contact through which neutral, ultr... » read more

Power/Performance Bits: Jan. 6


3D nanoshaping A team of researchers led by Purdue University report they’ve developed a method for creating large-area patterns of 3D nanoshapes from metal sheets. They believe this represents a potential manufacturing system to inexpensively mass produce innovations such as "plasmonic metamaterials" for advanced technologies, and could enable high-speed electronics, advanced sensors and so... » read more

System Bits: Dec. 30


3D printing merges plastics, active electronics Princeton researchers have embedded tiny light-emitting diodes into a standard contact lens, allowing the device to project beams of colored light as part of a project demonstrating 3-D printing techniques. And while the lens is not designed for actual use — it requires an external power supply — the device was created to demonstrate the a... » read more

Power/Performance Bits: Dec. 30


Crafting ultrathin color coatings Harvard University researchers have developed a technique that coats a metallic object with an extremely thin layer of semiconductor, just a few nanometers thick. And while the semiconductor is a steely gray color, the object ends up shining in vibrant hues because the coating exploits interference effects in the thin films. Carefully tuned in the laboratory, ... » read more

System Bits: Dec. 23


Mini particle accelerator Researchers at MIT who succeeded last year in creating a material that could trap light and stop it in its tracks have now developed a more fundamental understanding of the process. The new work — which they said could help explain some basic physical mechanisms — shows that this behavior is connected to a wide range of other seemingly unrelated phenomena. Ligh... » read more

Is The Stacked Die Ecosystem Stagnating?


While the stacked die ecosystem in general is currently status quo, with not much happening in the past year, there is definitely work being done —albeit cautiously—on the design tools side of things. It would be easy to feel impatient that the design tools are not complete and available today for [getkc id="82" comment="2.5D"] and [getkc id="42" comment="3D IC"] implementation until hearin... » read more

← Older posts Newer posts →