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Ed Sperling

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Ed Sperling is the editor in chief of Semiconductor Engineering.

Author's Latest Posts

Where Is The Edge?
By Ed Sperling - 02 Oct, 2019 - Comments: 0

Mike Fitton, senior director of strategic planning at Achronix, talks about what the edge will look like, how that fits in with the cloud, what the requirements are both for processing and for storage, and how this concept will evolve.   Edge Knowledge Center Top stories, videos, blogs, white papers all related to the Edge » read more

Security Tradeoffs In A Shifting Global Supply Chain
By Ed Sperling - 30 Sep, 2019 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss a wide range of hardware security issues and possible solutions with Norman Chang, chief technologist for the Semiconductor Business Unit at ANSYS; Helena Handschuh, fellow at Rambus, and Mike Borza, principal security technologist at Synopsys. What follows are excerpts of that conversation. The first part of this discussion ca... » read more

The Great Data Flood Ahead
By Ed Sperling - 26 Sep, 2019 - Comments: 1

The number of devices connected to the Internet is expected to exceed 1 trillion devices over the next decade or so. The timeline is a bit fuzzy, in part because no one is actually counting all of these devices, but the implications are pretty clear. A data deluge of biblical proportions is headed our way, and so far no one has any idea of what to do with all of it. From a system-level s... » read more

Why Data Is So Difficult To Protect In AI Chips
By Ed Sperling - 25 Sep, 2019 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss a wide range of hardware security issues and possible solutions with Norman Chang, chief technologist for the Semiconductor Business Unit at ANSYS; Helena Handschuh, fellow at Rambus, and Mike Borza, principal security technologist at Synopsys. What follows are excerpts of that conversation. The first part of this discussion ca... » read more

Memory Subsystems In Edge Inferencing Chips
By Ed Sperling - 23 Sep, 2019 - Comments: 0

Geoff Tate, CEO of Flex Logix, talks about key issues in a memory subsystem in an inferencing chip, how factors like heat can affect performance, and where these kinds of chips will be used. » read more

Stacking Memory On Logic, Take Two
By Ed Sperling - 19 Sep, 2019 - Comments: 1

True 3D-ICs, where a memory die is stacked on top of a logic die using through-silicon vias, appear to be gaining momentum. There are a couple reasons why this is happening, and a handful of issues that need to be considered before even seriously considering this option. None of this is easy. On a scale of 1 to 10, this ranks somewhere around 9.99, in part because the EDA tools needed to rem... » read more

Why DRAM Won’t Go Away
By Ed Sperling - 18 Sep, 2019 - Comments: 0

Semiconductor Engineering sat down to talk about DRAM's future with Frank Ferro, senior director of product management at Rambus; Marc Greenberg, group director for product marketing at Cadence; Graham Allan, senior product marketing manager for DDR PHYs at Synopsys; and Tien Shiah, senior manager for memory marketing at Samsung Electronics. What follows are excerpts of that conversation. Part ... » read more

The New CXL Standard
By Ed Sperling - 16 Sep, 2019 - Comments: 0

Gary Ruggles, senior staff product marketing manager at Synopsys, digs into the new Compute Express Link standard, why it’s important for high bandwidth in AI/ML applications, where it came from, and how to apply it in current and future designs. » read more

Making Better Use Of Memory In AI
By Ed Sperling - 13 Sep, 2019 - Comments: 0

Steven Woo, Rambus fellow and distinguished inventor, talks about using number formats to extend memory bandwidth, what the impact can be on fractional precision, how modifications of precision can play into that without sacrificing accuracy, and what role stochastic rounding can play. » read more

Another Brick Or Two In The Chip Design Wall
By Ed Sperling - 12 Sep, 2019 - Comments: 1

Physical challenges come and go in the semiconductor world. But increasingly, they also stick around, showing up in inconvenient places at the worst time. The chip industry has confronted and solved some massive challenges over the years. There was the 1 micron lithography wall, which was supposed to be impenetrable. That was followed by the 193nm litho challenge, which cost many billions of... » read more

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