Author's Latest Posts


How To Streamline Your Advanced Package Interconnect Designs


Monolithic system-on-chip (SoC) designs was once a popular choice. However, they face significant constraints in the era of AI. By forcing all chip functions into a single die and process node, they reduce engineering, manufacturing, and design cost flexibility. In contrast, the multi-die nature of chiplets enables different SoC functions to be designed and verified independently and fabrica... » read more

Transforming Data Management In EDA: Preparing For The AI Era


In today’s fast-paced electronics design automation (EDA) environment, effective data management has become essential. Growing design complexity, distributed teams, and the accelerating adoption of AI/ML are pushing organizations to rethink how they manage, track, and leverage decades of engineering data. From manual workarounds to data management Many engineers discover the importance ... » read more