Mark LaPedus

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Mark LaPedus is Executive Editor for manufacturing at Semiconductor Engineering.

Author's Latest Posts

Leti’s Next Focus
By Mark LaPedus - 19 Jul, 2018 - Comments: 0

Emmanuel Sabonnadière, chief executive of Leti, sat down with Semiconductor Engineering to discuss R&D trends, a new deal with Soitec, and the latest developments at the France-based research organization. Leti is a research institute of CEA Tech. What follows are excerpts of that conversation. SE: Leti recently formed an alliance with Soitec. Under the terms, Leti and Soitec are formin... » read more

Embedded Flash Scaling Limits
By Mark LaPedus - 19 Jul, 2018 - Comments: 3

Embedded nonvolatile flash memory has played a key role in chips for years, but the technology is beginning to face some scaling and cost roadblocks and it’s not clear what comes next. Embedded flash is used in several markets, such as automotive, consumer and industrial. But the automotive sector appears to be the most concerned about the future of the technology. Typically, a car incorpo... » read more

Fabs Meet Machine Learning
By Mark LaPedus - 19 Jul, 2018 - Comments: 2

Aki Fujimura, chief executive of D2S, sat down with Semiconductor Engineering to discuss Moore’s Law and photomask technology. Fujimura also explained how artificial intelligence and machine learning are impacting the IC industry. What follows are excerpts of that conversation. SE: For some time, you’ve said we need more compute power. So we need faster chips at advanced nodes, but cost... » read more

Manufacturing Bits: July 16
By Mark LaPedus - 16 Jul, 2018 - Comments: 0

Levitating metrology The Instituto de Ciencias Físicas UNAM has developed a new contaminant detection technique. It uses sound waves to levitate droplets of water for sampling purposes. Researchers use a technique called laser induced breakdown spectroscopy (LIBS). The technique analyzes heavy metals in levitating drops of water, according to The Optical Society (OSA) journal Optics Letter... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 13 Jul, 2018 - Comments: 0

Chipmakers GlobalFoundries said that the company’s 22nm FD-SOI technology has delivered more than $2 billion worth of client design win revenue. With more than 50 total client designs, the technology is designed for automotive, 5G connectivity and the Internet of Things (IoT). Helic has announced that its electromagnetic (EM) modeling engine has been certified for GlobalFoundries’ 22nm ... » read more

Bridges Vs. Interposers
By Mark LaPedus - 12 Jul, 2018 - Comments: 4

The number of technology options continue to grow for advanced packaging, including new and different ways to incorporate so-called silicon bridges in products. For some time, Intel has offered a silicon bridge technology called Embedded Multi-die Interconnect Bridge (EMIB), which makes use of a tiny piece of silicon with routing layers that connects one chip to another in an IC package. In ... » read more

Manufacturing Bits: July 10
By Mark LaPedus - 10 Jul, 2018 - Comments: 0

Ruthenium interconnects Imec has developed a process to enable ruthenium (Ru) interconnects in chips at 5nm and beyond. Ru is one of several candidates to replace traditional copper as the interconnect material in chips. The interconnects, which reside on the top of the transistor, consist of tiny copper wiring schemes that transfer electrical signals from one transistor to another. The int... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 06 Jul, 2018 - Comments: 0

Chipmakers Last year, Micron filed suit against UMC, alleging that UMC stole memory technology from the company and transferred it to Jinhua Integrated Circuit Co., a DRAM maker in China. In response, UMC filed patent infringement lawsuits against Micron in the mainland China courts in January of 2018 This week, Micron appears to have suffered a legal setback in its suit against Taiwan�... » read more

China IP Battle Takes New Turn
By Mark LaPedus - 03 Jul, 2018 - Comments: 0

Micron Technology appears to have suffered a legal setback in its suit against Taiwan’s United Microelectronics Corp. (UMC) in China. On Tuesday, UMC announced that the Fuzhou Intermediate People's Court of the People's Republic of China (PRC) issued a preliminary injunction against Micron Semiconductor (Xi'an) and Micron Semiconductor (Shanghai), enjoining Micron from offering to sell, an... » read more

Manufacturing Bits: July 3
By Mark LaPedus - 03 Jul, 2018 - Comments: 0

X-ray holography Using a technique called X-ray holography, a group of researchers have uncovered the phase transitions of vanadium dioxide. X-ray holography is a promising high-resolution metrology technique. Vanadium dioxide is one of many materials that can exhibit metal or insulator properties depending on the temperature. Vanadium dioxide can switch from an insulating to a metallic pha... » read more

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