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FPGA-Based HW/SW Platform For Pre-Silicon Emulation Of RISC-V Designs (Barcelona Supercomputing Center)
By Technical Paper Link - 15 Feb, 2024 - Comments: 0

A technical paper titled “Makinote: An FPGA-Based HW/SW Platform for Pre-Silicon Emulation of RISC-V Designs” was published by researchers at Barcelona Supercomputing Center and Universitat Politècnica de Catalunya. Abstract: "Emulating chip functionality before silicon production is crucial, especially with the increasing prevalence of RISC-V-based designs. FPGAs are promising candidate... » read more

HW Security Bug Characteristics in Google’s OpenTitan Silicon Root Of Trust Project 
By Technical Paper Link - 15 Feb, 2024 - Comments: 0

A technical paper titled “An Investigation of Hardware Security Bug Characteristics in Open-Source Projects” was published by researchers at NYU Tandon School of Engineering and University of Calgary. Abstract: "Hardware security is an important concern of system security as vulnerabilities can arise from design errors introduced throughout the development lifecycle. Recent works have pro... » read more

Directly Writing and Rewriting Photonic Chips on Low-Loss Phase-Change Thin Films
By Technical Paper Link - 15 Feb, 2024 - Comments: 0

A technical paper titled “Freeform direct-write and rewritable photonic integrated circuits in phase-change thin films” was published by researchers at University of Washington, University of Maryland, and Tianjin University. Abstract: "Photonic integrated circuits (PICs) with rapid prototyping and reprogramming capabilities promise revolutionary impacts on a plethora of photonic technolo... » read more

New Metasurface Architecture To Deliver Ultrafast Information Processing And Versatile Terahertz Sources
By Technical Paper Link - 15 Feb, 2024 - Comments: 0

A technical paper titled “Light-driven nanoscale vectorial currents” was published by researchers at Los Alamos National Laboratory, Menlo Systems, University of California Davis, Columbia University, Sandia National Laboratories, and Intellectual Ventures. Abstract: "Controlled charge flows are fundamental to many areas of science and technology, serving as carriers of energy and informa... » read more

Metal Films On 2D Materials: vdW Contacts And Raman Enhancement (University of Cambridge)
By Technical Paper Link - 14 Feb, 2024 - Comments: 0

A technical paper titled “Metal Films on Two-Dimensional Materials: van der Waals Contacts and Raman Enhancement” was published by researchers at University of Cambridge. Abstract: "Electronic devices based on two-dimensional (2D) materials will need ultraclean and defect-free van der Waals (vdW) contacts with three-dimensional (3D) metals. It is therefore important to understand how vdW ... » read more

Simulation Of A Kicked Ising Quantum System On The Heavy Hexagon Lattice
By Technical Paper Link - 14 Feb, 2024 - Comments: 0

A technical paper titled “Efficient Tensor Network Simulation of IBM’s Eagle Kicked Ising Experiment” was published by researchers at the Flatiron Institute and New York University. Abstract: "We report an accurate and efficient classical simulation of a kicked Ising quantum system on the heavy hexagon lattice. A simulation of this system was recently performed on a 127-qubit quantum pr... » read more

SW/HW Codesign For CXL Memory Disaggregation In Billion-Scale Nearest Neighbor Search (KAIST)
By Technical Paper Link - 14 Feb, 2024 - Comments: 0

A technical paper titled “Bridging Software-Hardware for CXL Memory Disaggregation in Billion-Scale Nearest Neighbor Search” was published by researchers at the Korea Advanced Institute of Science and Technology (KAIST) and Panmnesia. Abstract: "We propose CXL-ANNS, a software-hardware collaborative approach to enable scalable approximate nearest neighbor search (ANNS) services. To this e... » read more

A Method To Transform Everyday Materials Into Conductors For Use In Quantum Computers
By Technical Paper Link - 14 Feb, 2024 - Comments: 0

A technical paper titled “Controllable strain-driven topological phase transition and dominant surface-state transport in HfTe5” was published by researchers at University of California Irvine, Los Alamos National Laboratory, and University of Tennessee. Abstract: "The fine-tuning of topologically protected states in quantum materials holds great promise for novel electronic devices. Howe... » read more

Heterogeneous Integration And Electronics Packaging Manufacturing Roadmap (SEMI & UCLA)
By Technical Paper Link - 09 Feb, 2024 - Comments: 0

A report titled “Manufacturing Roadmap for Heterogeneous Integration and Electronics Packaging (MRHIEP)” was published by researchers at SEMI and the University of California Los Angeles (UCLA)'s Center for Heterogeneous Integration and Performance Scaling (CHIPS), and funded by the National Institute of Standards and Technology (NIST). MRHIEP Goals: "The goal of MRHIEP is to develop an o... » read more

Modeling And Analyzing Open-Source SoCs For Low-Power Cyber-Physical Systems
By Technical Paper Link - 08 Feb, 2024 - Comments: 0

A technical paper titled “TOP: Towards Open & Predictable Heterogeneous SoCs” was published by researchers at University of Bologna, ETH Zurich, and University of California San Diego. Abstract: "Ensuring predictability in modern real-time Systems-on-Chip (SoCs) is an increasingly critical concern for many application domains such as automotive, robotics, and industrial automation. An... » read more

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