The New CXL Standard
By Ed Sperling - 16 Sep, 2019 - Comments: 0

Gary Ruggles, senior staff product marketing manager at Synopsys, digs into the new Compute Express Link standard, why it’s important for high bandwidth in AI/ML applications, where it came from, and how to apply it in current and future designs. » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 13 Sep, 2019 - Comments: 0

Chipmakers and OEMs Delphi Technologies is in volume production with a 800 volt silicon carbide (SiC) inverter for next-generation electric and hybrid vehicles. The inverter extends electric vehicle (EV) ranges. It also halves the charging times compared with today's 400 volt systems. In a separate announcement, Delphi Technologies and Cree have announce a partnership to utilize SiC semicon... » read more

Week in Review – IoT, Security, Autos
By Jeff Dorsch - 13 Sep, 2019 - Comments: 0

Products/Services Arm and Swift Navigation will collaborate on providing technology to developers of autonomous vehicles and connected cars. San Francisco-based Swift Navigation, which offers Global Navigation Satellite System positioning technology for AVs, is teaming with the chip design company to offer Swift’s solutions as an option on Arm-based platforms, the companies say. Swift’s St... » read more

Making Better Use Of Memory In AI
By Ed Sperling - 13 Sep, 2019 - Comments: 0

Steven Woo, Rambus fellow and distinguished inventor, talks about using number formats to extend memory bandwidth, what the impact can be on fractional precision, how modifications of precision can play into that without sacrificing accuracy, and what role stochastic rounding can play. » read more

Week In Review: Design, Low Power
By Jesse Allen - 13 Sep, 2019 - Comments: 0

M&A ANSYS will acquire Livermore Software Technology Corp. (LSTC), a provider of explicit dynamics and other advanced finite element analysis technology. Based in Livermore, CA, LSTC was founded in 1987 to commercialize the DYNA3D technology developed at the Lawrence Livermore National Laboratory. DYNA3D became the company's premier product LS-DYNA, a general purpose nonlinear finite eleme... » read more

Another Brick Or Two In The Chip Design Wall
By Ed Sperling - 12 Sep, 2019 - Comments: 1

Physical challenges come and go in the semiconductor world. But increasingly, they also stick around, showing up in inconvenient places at the worst time. The chip industry has confronted and solved some massive challenges over the years. There was the 1 micron lithography wall, which was supposed to be impenetrable. That was followed by the 193nm litho challenge, which cost many billions of... » read more

Breaking Down The AI Memory Wall
By Steven Woo - 12 Sep, 2019 - Comments: 0

Over the past few decades, the semiconductor industry has witnessed the rapid evolution of memory technology as new memories helped to usher in new usage models that characterized each decade. For example, synchronous memory helped drive the personal computer (PC) revolution in the 1990s, and this was quickly followed by specialized graphics memory (GPUs) for game consoles in the 2000s. When sm... » read more

3D Power Delivery
By Brian Bailey - 12 Sep, 2019 - Comments: 1

Getting power into and around a chip is becoming a lot more difficult due to increasing power density, but 2.5D and 3D integration are pushing those problems to whole new levels. The problems may even be worse with new packaging approaches, such as chiplets, because they constrain how problems can be analyzed and solved. Add to that list issues around new fabrication technologies and an emph... » read more

High-Performance DSP And Control Processing For Complex 5G Requirements
By Graham Wilson - 12 Sep, 2019 - Comments: 0

In the early 2000s, digital signal processors (DSP) were simple in architecture and limited in performance, but complex in programming. However, they evolved to meet of the increased performance requirements of 3G cellular baseband modem applications. A typical 3G modem system would have a single DSP optimized for dual/quad SIMD MAC performance with basic DSP filter instructions like Fast Fouri... » read more

Simplifying Ultra-Low Power System Design
By Paul Hill - 12 Sep, 2019 - Comments: 0

By Paul Hill and Gordon MacNee With any low-power design, the designer has the choice between choosing low-power components or switching off the power to peripheral devices. When considering the choice of non-volatile flash memories, the designer has these same two options available to them – each of which has its pros and cons from system operation, power consumption and reliability persp... » read more

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