Manufacturing Bits: Aug. 27

By Mark LaPedus - 27 Aug, 2019 - Comments: 0

Holographic lithography Switzerland’s Nanotech SWHL GmbH has come out of stealth mode and disclosed its initial technology—a holographic lithography system. Founded in 2015, Nanotech SWHL has developed a sub-wavelength holographic lithography system that generates and prints 3D images on surfaces with one mask at one exposure. Still in R&D, the system is initially targeted for advanced ... » read more

System Bits: Aug. 27

By Jeff Dorsch - 27 Aug, 2019 - Comments: 0

A ring of 18 carbon atoms Scientists at IBM Research – Zurich and Oxford University write about allotropes of carbon – the many versions of atomic carbon formations, such as diamonds and graphite. “Carbon, one of the most abundant elements in the universe, can exist in different forms - called allotropes - giving it completely different properties from color to shape to hardness. For... » read more

Power/Performance Bits: Aug. 27

By Jesse Allen - 27 Aug, 2019 - Comments: 0

The sound of typing Cybersecurity researchers at the Southern Methodist University found a way to detect what a user is typing based on sensor data collected from a nearby smartphone. The team found that acoustic signals produced by typing on a computer keyboard can successfully be picked up by a smartphone, which can then be processed to determine which keys were struck – even in noisy conf... » read more

Chip Security Needs A New Language

By Sven Beyer - 26 Aug, 2019 - Comments: 0

By Sven Beyer and Sergio Marchese Safety- and security-critical systems, such as connected autonomous vehicles, require high-integrity integrated circuits (ICs). Functional correctness and safety are necessary to establish IC integrity, but not sufficient. Security is another critical pillar of IC integrity. Systems and products using ICs with security vulnerabilities ultimately undermine th... » read more

EDA Gears Up For 3D

By Brian Bailey - 26 Aug, 2019 - Comments: 0

Semiconductor Engineering sat down to discuss changes required throughout the ecosystem to support three-dimensional (3D) chip design with Norman Chang, chief technologist for the Semiconductor Business Unit of ANSYS; John Park, product management director for IC packaging and cross-platform solutions at Cadence; John Ferguson, director of marketing for DRC applications at Mentor, a Siemens Bus... » read more

Week In Review: Manufacturing, Test

By Mark LaPedus - 23 Aug, 2019 - Comments: 0

AI chip boom or bust? The semiconductor industry is the most bullish about adopting artificial intelligence (AI), according to a new report from Accenture. Some 77% of semiconductor executives surveyed said they have adopted AI within their businesses or are piloting the technology. In addition, 63% of semiconductor executives expect that AI will have the greatest impact on their business over... » read more

Week in Review: IoT, Security, Autos

By Jeff Dorsch - 23 Aug, 2019 - Comments: 0

Products/Services Huawei Technologies is again delaying the public introduction of its Mate X foldable smartphone. It is unlikely the product will be marketed in the U.S., given the ongoing trade war. The official rollout now seems likely to come in November, in time for the holiday shopping season. Samsung Electronics has had its problems with foldable phones, yet those were due to manufactur... » read more

Week In Review: Design, Low Power

By Jesse Allen - 23 Aug, 2019 - Comments: 0

Xilinx debuted the Virtex UltraScale+ VU19P, which the company says is now the world's largest FPGA at 1.6X the size of its predecessor. The VU19P features 35 billion transistors, 9 million system logic cells, up to 1.5 terabits per-second of DDR4 memory bandwidth and up to 4.5 terabits per-second of transceiver bandwidth, and over 2,000 user I/Os. With a set of debug, visibility tools, and IP,... » read more

Surround And Conquer

By Ed Sperling - 22 Aug, 2019 - Comments: 0

The processor wars are back in full swing, this time with some new players in the field. But what defines winning this time around is far less obvious than it was in the past, and it will take years before we know the outcome. The strategy is the same, though, and it's one that has been in use for years in the tech world. It began in the 1990s, when IBM came to the realization that it could ... » read more

Making Security User Friendly

By Brian Bailey - 22 Aug, 2019 - Comments: 0

Serious tradeoffs between technology accessibility and other optimization factors, such as power and security, can crop up especially in the early days of a new product’s design. A new product appeals to a certain category of users who need it to perform well enough that the technology can move forward. They are willing to overlook rough edges in the product and sometimes even glory in the le... » read more

← Older posts Newer posts →