Enabling Faster Design, Verification and Debug of FPGAs
By Synopsys - 04 Sep, 2019 - Comments: 0

Field programmable gate arrays (FPGAs) are no longer the co-processor of full-custom chips and application-specific integrated circuits (ASICs). Today’s FPGA offerings include devices as large and complex as any ASIC system-on-chip (SoC) on the market. The dramatic increase in size, complexity and functionality means that many FPGA development teams are adopting ASIC-style design, verificatio... » read more

Manufacturing Bits: Sept. 3
By Mark LaPedus - 03 Sep, 2019 - Comments: 1

Modeling SiC defects The Institute of Nuclear Physics of the Polish Academy of Sciences (IFJ PAN) has developed a model that reveals the nature of crystal defects in silicon carbide (SiC). Defectivity is an issue for SiC, a compound semiconductor material based on silicon and carbon. Today, SiC is used to make specialized power semiconductors for high-voltage applications, such as electric ... » read more

System Bits: Sept. 3
By Jeff Dorsch - 03 Sep, 2019 - Comments: 0

Microprocessor built with carbon nanotubes Researchers at the Massachusetts Institute of Technology were able to design a microprocessor with carbon nanotubes and fabricate the chip with traditional processes, an advance that could be used in next-generation computers. Work on producing carbon nanotube field-effect transistors has gone on for some time. Fabricated at scale, those CNFETs oft... » read more

Power/Performance Bits: Sept. 3
By Jesse Allen - 03 Sep, 2019 - Comments: 0

Nylon capacitor Researchers at the Max Planck Institute for Polymer Research, Johannes Gutenberg University of Mainz, and Lodz University of Technology developed a way to fabricate ferroelectric nylon thin-film capacitors. Nylons consist of a long chain of polymers and, along with use in textiles, exhibit ferroelectric properties. However, electronic applications have been limited as there ... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 30 Aug, 2019 - Comments: 0

Chipmakers GlobalFoundries has filed suits in the U.S. and Germany, alleging that semiconductor manufacturing technologies used by TSMC infringe upon 16 of GF's patents. The suits were filed in the U.S. International Trade Commission (ITC), the U.S. Federal District Courts in the Districts of Delaware and the Western District of Texas, and the Regional Courts of Dusseldorf and Mannheim in Germ... » read more

Week in Review: IoT, Security, Autos
By Jeff Dorsch - 30 Aug, 2019 - Comments: 0

Products/Services Rambus reports completing its acquisition of Northwest Logic, a supplier of memory, PCIe, and MIPI digital controllers. Meanwhile, the company named Sean Fan as chief operating officer. He previously served as vice president and general manager of the data center business unit at Renesas Electronics. Prior to its acquisition by Renesas earlier this year, Fan held senior execu... » read more

Week In Review: Design, Low Power
By Jesse Allen - 30 Aug, 2019 - Comments: 0

Rambus completed its acquisition of Northwest Logic, a supplier of memory, PCIe and MIPI digital controllers. The Hillsboro, OR office of Northwest Logic will remain in place, along with the entire staff. SureCore launched a new low power design service. The company's offering includes concept-to-tape-out low power mixed-signal design expertise such as design and layout capabilities, technol... » read more

On The Cusp Of 5G
By Kevin Fogarty - 29 Aug, 2019 - Comments: 0

Carriers and chipmakers are celebrating the rollout of the first standards-compliant commercial 5G services. "We are, officially in the era of 5G," said John Smee, vice president of engineering at Qualcomm at the recent 5G Summit at IEEE's International Microwave Symposium (IMS) in Boston. Movement is happening on the commercial end. Major U.S. carriers Verizon, AT&T and Sprint have set ... » read more

Taking Energy Into Account
By Ann Mutschler - 28 Aug, 2019 - Comments: 1

Considering power throughout the SoC design flow is common practice. The same cannot be said for energy, although that is beginning to change as chips increasingly incorporate heterogeneous processing elements. Combined with this, AI/ML/DL technologies increasingly allow engineering teams to explore and optimize design data for more targeted and efficient systems. But this approach also requ... » read more

Blog Review: Aug. 28
By Jesse Allen - 28 Aug, 2019 - Comments: 0

Cadence's Paul McLellan takes a look at the numerous challenges in designing and manufacturing Cerebras' massive 400,000 processor, 1.2 trillion transistor chip. Synopsys' Taylor Armerding points to a lack of robust mobile app security and why building in security from the beginning can lead to greater productivity and cost saving. Mentor's Paul Johnston takes a look at what's in store at... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2026 SMG   |  Terms of Service  |  Privacy Policy