Say Welcome to the Machine: Low-Power Machine Learning for Smart IoT Applications
By Synopsys - 24 Jul, 2019 - Comments: 0

By Pieter van der Wolf, Principal R&D Engineer, Synopsys Inc. and Dmitry Zakharov, Senior Software Engineer, Synopsys Inc Smart IoT devices that interact intelligently with their users are appearing in many application areas. Increasingly, these devices apply machine learning technology for processing captured sensor data, so that smart actions can be taken based on recognized patterns. ... » read more

Node Within A Node
By Ed Sperling - 24 Jul, 2019 - Comments: 0

Enough margin exists in manufacturing processes to carve out the equivalent of a full node of scaling, but shrinking that margin will require a collective push across the entire semiconductor manufacturing supply chain. Margin is built into manufacturing at various stages to ensure that chips are manufacturable and yield sufficiently. It can include everything from variation in how lines are... » read more

Recent Earthquakes Highlight Risk To Semiconductor Manufacturing Sites
By Adrienne Downey - 24 Jul, 2019 - Comments: 0

On July 4, 2019, southern California experienced a 6.4 magnitude earthquake followed by a 7.1 earthquake the next day. Both earthquakes occurred near the town of Ridgecrest, but they were not related to the San Andreas fault, an 800-mile fault zone in California where two tectonic plates meet. The San Andreas fault is generally considered to be where “the big one” could occur in California,... » read more

Material Choices In Printed Temperature Sensors
By Ed Sperling - 24 Jul, 2019 - Comments: 0

Vijaya Kayastha, lead device development engineer at Brewer Science, talks about what’s needed for printed temperature sensors, what happens when there are impurities in the materials, how these sensors respond to stress, and how costs compare to traditional sensors. » read more

Cybersecurity And Functional Safety: The Case For Embedded Analytics
By UltraSoC - 24 Jul, 2019 - Comments: 0

From advanced driver assistance systems (ADAS) to a new generation of robots and medical systems, we are seeing an explosion in the development of cyber-physical systems. Because these systems use advanced software to interact with the physical world, security and safety are paramount concerns. These issues are reflected in many industries by the use of safety and security standards based on a ... » read more

Blog Review: July 24
By Jesse Allen - 24 Jul, 2019 - Comments: 0

Synopsys' Taylor Armerding notes that while two Florida cities may have saved taxpayers millions by paying ransomware demands, doing so is likely setting up a ransomware tsunami that threatens other municipalities. In a video, Cadence's Jacek Duda digs into what's going on with the upcoming USB4 standard and what will change compared to USB 3.x. Mentor's Colin Walls shares a few embedded ... » read more

Improving Execution Predictability On Linux With SLX
By Silexica - 24 Jul, 2019 - Comments: 0

For many applications, predictability and determinism are often times more desirable than raw performance. This is especially true in emerging markets, like cyber-physical systems or the internet-of-things. For many practical reasons, however, most engineers rely on Linux, which in multicore systems is usually neither predictable nor deterministic. This whitepaper analyzes the predictability of... » read more

Meeting The Demands Of PAM4 Systems At 56Gbps And Beyond
By eSilicon - 24 Jul, 2019 - Comments: 0

According to an IDC white paper sponsored by Seagate the global datasphere will grow from 33 zettabytes (one zettabye = one trillion gigabytes) in 2018 to 175 zettabytes by 2025. This white paper also reports that today, more than 5 billion consumers interact with data every day. By 2025, that number will be 6 billion, or 75 percent of the world’s population. Figure 1 depicts this exponential... » read more

Changes In Smart Manufacturing
By Ed Sperling - 23 Jul, 2019 - Comments: 0

Tom Salmon, vice president of collaborative technology platforms at SEMI, talks with Semiconductor Engineering about what’s changing in smart manufacturing, the impact of more data and AI, what the ROI looks like for these kinds of investments, and how that affects overall equipment efficiency. While the biggest bang will come from advanced nodes, it also is targeted at advanced packaging. » read more

System Bits: July 23
By Jeff Dorsch - 23 Jul, 2019 - Comments: 0

Superconductivity seen in trilayer graphene Stanford University and University of California at Berkeley researchers discovered signs of superconductivity in stacking three-layer sheets of graphene, they report. “It’s definitely an exciting development,” says Cory Dean, a physicist at Columbia University. Dean notes that bilayer graphene superconducts only when the atomic lattices of ... » read more

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