3D Integration And Test Results From TSV-Processed Chips (CERN et al.)


A new technical paper titled "3D integration of pixel readout chips using Through-Silicon-Vias" was published by researchers at CERN, IZM Fraunhofer and University of Geneva. Abstract "Particle tracking and imaging detectors are becoming increasingly complex, driven by demands for densely integrated functionality and maximal sensitive area. These challenging requirements can be met using 3D... » read more

Impact of Extremely Low Temperatures On The 5nm SRAM Array Size and Performance


A new technical paper titled "Novel Trade-offs in 5 nm FinFET SRAM Arrays at Extremely Low Temperatures" was published by researchers at University of Stuttgart, IIT Kanpur, National Yang Ming Chiao Tung University, Khalifa University, and TU Munich. Abstract "Complementary metal–oxide–semiconductor (CMOS)-based computing promises drastic improvement in performance at extremely low temp... » read more

Liquid-Infused Nanostructured Composites As A Universal Thermal Interface Solution for Cooling Applications


A new technical paper titled "Liquid-infused nanostructured composite as a high-performance thermal interface material for effective cooling" was published by researchers at Carnegie Mellon University, Oregon State University and Arieca. Abstract "Effective heat dissipation remains a grand challenge for energy-dense devices and systems. As heterogeneous integration becomes increasingly inev... » read more

Vertical AlGaN Heterostructures For Integrated Photonics


A new technical paper titled "AlGaN/AlN heterostructures: an emerging platform for integrated photonics" was published by researchers at Humboldt-Universität zu Berlin and Ferdinand-Braun-Institut (FBH). Abstract "We introduce a novel material for integrated photonics and investigate aluminum gallium nitride (AlGaN) on aluminum nitride (AlN) templates as a platform for developing reconfig... » read more

Chip Industry Technical Paper Roundup: Jan. 20


New technical papers recently added to Semiconductor Engineering’s library: [table id=398 /] Find all technical papers here. » read more

Research Bits: Jan. 20


Self-correcting memristor array Researchers at Korea Advanced Institute of Science and Technology (KAIST), Seoul National University, Sungkyunkwan University, Electronics and Telecommunications Research Institute (ETRI), and Yonsei University developed a memristor-based neuromorphic chip that can learn and correct errors, enabling it to adapt to immediate environmental changes. The system c... » read more

Design-Space Analysis of M3D FPGA With BEOL Configuration Memories (Georgia Tech, UCLA)


A new technical paper titled "Monolithic 3D FPGAs Utilizing Back-End-of-Line Configuration Memories" was published by researchers at Georgia Tech and UCLA. Abstract "This work presents a novel monolithic 3D (M3D) FPGA architecture that leverages stackable back-end-of-line (BEOL) transistors to implement configuration memory and pass gates, significantly improving area, latency, and power ef... » read more

Chip Industry Week In Review


GlobalFoundries will create a new center for advanced packaging and testing of U.S.-made essential chips within its New York manufacturing facility. A flurry of announcements on advanced semiconductors and AI rolled out this week as U.S. President Biden wrapped up his term: The Biden-Harris Administration released an Interim Final Rule on Artificial Intelligence Diffusion to strengthen ... » read more

Loss Processes in Electrochemically Charged Semiconductor Nanocrystal Films (TU Delft)


A new technical paper titled "Where Do the Electrons Go? Studying Loss Processes in the Electrochemical Charging of Semiconductor Nanomaterials" was published by researchers at Delft University of Technology. Abstract "Electrochemical charging of films of semiconductor nanocrystals (NCs) allows precise control over their Fermi level and opens up new possibilities for use of semiconductor NC... » read more

Advanced Packaging: A Curse Or A Blessing For Trustworthiness?


In recent years, the issue of trustworthiness in electronics has become increasingly important, especially in areas where security is of the essence such as the automotive sector, industry, and critical infrastructure. These sectors depend on electronic systems that are not only powerful but also absolutely reliable and, above all, secure. This represents a major challenge, as the increasing co... » read more

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