Revolutionizing IC Packaging With High-Density RDL Technology

By Curtis Zwenger - 24 Oct, 2024 - Comments: 0

The demand for high-performance devices, particularly in AI, HPC, and data centers, has surged dramatically in the ever-evolving landscape of integrated circuit technology. This demand has been further accelerated by the COVID-19 pandemic, pushing the boundaries of silicon technology to its limits. Enter Amkor’s S-SWIFT, a packaging solution designed to address these challenges and revolution... » read more

Multi-Tier Die Stacking Enables Efficient Manufacturing

By Jessica Albright - 24 Oct, 2024 - Comments: 0

Advanced packaging is currently facing a critical challenge to increase manufacturing efficiency without sacrificing device performance. Vertical integration techniques, such as multi-tier die stacking and hybrid bonding, enable increased integration density, therefore improving yield of high-quality devices. However, these highly precise processes require significant attention to defectivity... » read more

New Approaches To Power Decoupling

By Bryon Moyer - 24 Oct, 2024 - Comments: 0

Decoupling capacitors have long been an important aspect of maintaining a clean power source for integrated circuits, but with noise caused by rising clock frequencies, multiple power domains, and various types of advanced packaging, new approaches are needed. Power is a much more important factor than it used to be, especially in the era of AI. “Doing an AI search consumes 10X the power t... » read more

Reduce Augmented Reality Device Time-to-Market by Bringing Manufacturing Impact to Optical Simulation

By Synopsys - 24 Oct, 2024 - Comments: 0

Disruptive AR systems will push the limits of optics: limits in design, limits in manufacturing, and limits in overall system integration. The trend of optical components being integrated into more complex miniaturized systems is impacting optical software. Optical design software has been around for decades to design, simulate, and analyze any optical component from lenses and mirrors to light... » read more

Overview Of The Current State of the Development Of Curvilinear Masks

By D2S - 24 Oct, 2024 - Comments: 0

A technical paper titled "Curvilinear masks overview: manufacturable mask shapes are more reliably manufacturable" was published by researchers at D2S. The paper covers: The rationale for curvilinear masks The application of the curvilinear inverse lithography technology The state of readiness of the curvilinear mask-making infrastructure, including mask rule checking, metrology, ... » read more

The Growing Imperative Of Hardware Security Assurance In IP And SoC Design

By Pavani Jella - 24 Oct, 2024 - Comments: 0

In an era where technology permeates every aspect of our lives, the semiconductor industry serves as the backbone of innovation. From IoT devices to data centers, every piece of technology relies on integrated circuits (ICs) such as intellectual property (IP) cores and system on chips (SoCs). As these technologies become increasingly pervasive, the importance of hardware security assurance in t... » read more

Monolithic Vs. Heterogeneous Integration

By Ed Sperling - 24 Oct, 2024 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss two very different paths forward for semiconductors and what's needed for each, with Jamie Schaeffer, vice president of product management at GlobalFoundries; Dechao Guo, director of advanced logic technology R&D at IBM; Dave Thompson, vice president at Intel; Mustafa Badaroglu, principal engineer at Qualcomm; and Thomas Po... » read more

Current and Emerging Heterogeneous Integration Technologies For High-Performance Systems (Georgia Tech)

By Technical Paper Link - 23 Oct, 2024 - Comments: 0

A technical paper titled "Heterogeneous Integration Technologies for Artificial Intelligence Applications" was published by Georgia Tech. Abstract "The rapid advancement of artificial intelligence (AI) has been enabled by semiconductor-based electronics. However, the conventional methods of transistor scaling are not enough to meet the exponential demand for computing power driven by AI. ... » read more

Overview Of Security Verification Methodologies for SoC Designs Pre-Silicon (U. of Florida)

By Technical Paper Link - 23 Oct, 2024 - Comments: 0

A technical paper titled "A Survey on SoC Security Verification Methods at the Pre-silicon Stage" was recently published by researchers at University of Florida. Abstract "This paper presents a survey of the state-of-the-art pre-silicon security verification techniques for System-on-Chip (SoC) designs, focusing on ensuring that designs, implemented in hardware description languages (HDLs) a... » read more

Characterizing Defects Inside Hexagonal Boron Nitride (KAIST, NYU, et al.)

By Technical Paper Link - 23 Oct, 2024 - Comments: 0

A new technical paper titled "Characterizing Defects Inside Hexagonal Boron Nitride Using Random Telegraph Signals in van der Waals 2D Transistors" was published by researchers at KAIST, NYU, Brookhaven National Laboratory, and National Institute for Materials Science. Abstract: "Single-crystal hexagonal boron nitride (hBN) is used extensively in many two-dimensional electronic and quantu... » read more

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