Liquid Cooling, Meeting The Demands Of AI Data Centers
By Barry Pangrle - 04 Sep, 2024 - Comments: 0

Many Porsche “purists” reflect forlornly upon the 1997, 5th generation, 996 version of the iconic 911 sports car. It was the first year of the water-cooled engine versions of the 911, which had previously been based on air-cooled engines since their entry into the market in 1964. The 911 was also the successor to the popular air-cooled 356. For over three decades, Porsche’s flagship 911 w... » read more

New AI Processors Architectures Balance Speed With Efficiency
By Ed Sperling - 04 Sep, 2024 - Comments: 1

Leading AI systems designs are migrating away from building the fastest AI processor possible, adopting a more balanced approach that involves highly specialized, heterogeneous compute elements, faster data movement, and significantly lower power. Part of this shift revolves around the adoption of chiplets in 2.5D/3.5D packages, which enable greater customization for different workloads and ... » read more

Blog Review: Sept. 4
By Jesse Allen - 04 Sep, 2024 - Comments: 0

Synopsys' Jyotika Athavale and Randy Fish sit down with Google's Rama Govindaraju and Microsoft's Robert S. Chappell to discuss silent data corruption and why a solution will require chip designers and manufacturers, software and hardware engineers, vendors, and anyone involved in computer data to collaborate and take the issue seriously. Siemens' Karen Chow and Joel Mercier explain the rela... » read more

Research Bits: Sept. 3
By Jesse Allen - 03 Sep, 2024 - Comments: 0

3D printing of specialized antennas, sensors Researchers from the National University of Singapore developed a 3D printing technique that can be used to create three dimensional, self-healing electronic circuits. Called tension-driven CHARM3D, the technique enables the 3D printing of free-standing metallic structures without requiring support materials and external pressure. It uses Field�... » read more

Chip Industry Technical Paper Roundup: Sept. 3
By Linda Christensen - 03 Sep, 2024 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=256 /] More ReadingTechnical Paper Library home » read more

Hardware Security: One-Key Premise of Logic Locking
By Technical Paper Link - 30 Aug, 2024 - Comments: 0

A new technical paper titled "Late Breaking Results: On the One-Key Premise of Logic Locking" was published by researchers at Synopsys. Abstract "The evaluation of logic locking methods has long been predicated on an implicit assumption that only the correct key can unveil the true functionality of a protected circuit. Consequently, a locking technique is deemed secure if it resists a good ... » read more

Chip Industry Week in Review
By The SE Staff - 30 Aug, 2024 - Comments: 1

The Biden-Harris Administration announced preliminary terms with HP for $50 million in direct funding under the CHIPs and Science Act to support the expansion and modernization of HP’s existing microfluidics and microelectromechanical systems (“MEMS”) facility in Corvallis, Oregon. CHIPS for America launched the CHIPS Metrology Community, a collaborative initiative designed to advance ... » read more

A New Generation Of 7400 Socket
By Brian Bailey - 29 Aug, 2024 - Comments: 0

When I was 18, and just been accepted at Brunel University in West London to start my undergraduate degree in electrical and electronic engineering, I sent off a letter to Texas Instruments telling them about the journey ahead of me and asked if they could they send me a copy of their TTL Data Book. A few weeks later a package arrived and there it was. This incredible brown/orange book, thicker... » read more

Simultaneous Bi-Directional Signaling: A Breakthrough Alternative For Multi-Die Assemblies
By Ramin Farjadrad - 29 Aug, 2024 - Comments: 0

In designing multi-die systems-in-package, with or without chiplets, it is easy to think of the interconnect between dies as simply analogous to the interconnect between functional blocks on a single die. But this analogy can lead architects and designers into a blind alley from which it becomes impossible to meet system performance and power requirements. The reason lies in fundamental differe... » read more

Design Optimal ESD Protection With Context-Aware SPICE Simulation
By Neel Natekar - 29 Aug, 2024 - Comments: 0

Electrostatic discharge (ESD) is a major reliability concern for modern ICs. Ensuring the robustness of ICs in an ESD event by providing adequate ESD protection is proving to be a major challenge for IC designers due to factors such as shrinking of the design features, reduction in gate oxide thickness, increase in the contact and interconnect resistance and an increase in the overall design co... » read more

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