Blog Review: March 3
By Jesse Allen - 03 Mar, 2021 - Comments: 0

Siemens EDA's Ray Salemi considers incrementalism in engineering, the transition from drawing circuits to writing RTL, and the next big leap of using proxy-driven testbenches written in Python. Cadence's Shyam Sharma looks at key changes from LPDDR5 in the LPDDR5X SDRAM standard, which extends clock frequencies to include 937MHz and 1066MHz resulting in max data rates of 7500MT/s and 8533 MT... » read more

Chiplets For The Masses
By Brian Bailey - 03 Mar, 2021 - Comments: 2

Chiplets are a compelling technology, but so far they are available only to a select few players in the industry. That's changing, and the industry has taken little steps to get there, but timing for when you will be able to buy a chiplet to integrate into your system remains uncertain. While new fabrication nodes continue to be developed, scaling is coming to an end, be it for physical or e... » read more

4 Horsemen Of Wire Harness Manufacturing
By Siemens EDA - 03 Mar, 2021 - Comments: 0

Growing demands for automotive electrical and electronic (E/E) features drive increased complexity in the wiring harnesses that carry power and data signals to components around the vehicle. As a result, the wire harness manufacturing industry is expected to see significant growth, expanding into a 91 billion dollar industry in 2025. However, wire harness manufacturers often operate on small pr... » read more

Achieving Faster Closure With Reduced Setup And Debug Using Advanced RTL Static Signoff Platform
By Synopsys - 03 Mar, 2021 - Comments: 0

Many design houses are continually seeking ways to shorten their effective design cycle to address demanding market requirements, gain a formidable technological advantage, and secure leadership in their respective industries. This pressure can cause designers to get extremely overwhelmed by strict timelines. To meet tight project timelines, design teams often resort to identifying industry-lea... » read more

Manufacturing Bits: March 2
By Mark LaPedus - 02 Mar, 2021 - Comments: 0

Next-gen AFM At the recent SPIE Advanced Lithography conference, Imec, Infinitesima and others described a new metrology tool technology called a Rapid Probe Microscope (RPM). Infinitesima has shipped its first RPM 3D system, enabling three-dimensional (3D) metrology applications for leading-edge chips. The system was jointly developed with Imec. In the IEDM paper, Imec and Infinitesima... » read more

Predicting And Avoiding Failures In Automotive Chips
By Ed Sperling - 02 Mar, 2021 - Comments: 0

Semiconductor Engineering sat down to discuss automotive electronics reliability with Jay Rathert, senior director of strategic collaborations at KLA; Dennis Ciplickas, vice president of advanced solutions at PDF Solutions; Uzi Baruch, vice president and general manager of the automotive business unit at OptimalPlus; Gal Carmel, general manager of proteanTecs' Automotive Division; Andre van de ... » read more

Power/Performance Bits: March 2
By Jesse Allen - 02 Mar, 2021 - Comments: 0

Fast-charging EV battery Electric vehicle adoption faces challenges from consumers' range anxiety and the extended lengths of time needed to charge a car's battery. Researchers at Pennsylvania State University are trying to address this by developing lithium iron phosphate EV batteries that have a range of 250 miles with the ability to charge in 10 minutes. It also is expected to have a lifeti... » read more

Startup Funding: February 2021
By Jesse Allen - 01 Mar, 2021 - Comments: 0

In February, several startups emerge from stealth, with one company working on AI inference architectures for the data center and another trying to make lenses thinner by patterning surfaces with tiny structures. Two new Chinese companies are trying to expand the country's semiconductor design ecosystem with GPUs and interface IP. Plus, a maker of AI chips for ADAS draws another massive round t... » read more

A Survey of Autonomous Vehicles: Enabling Communication Technologies and Challenges
By Technical Paper Link - 28 Feb, 2021 - Comments: 0

Abstract "The Department of Transport in the United Kingdom recorded 25,080 motor vehicle fatalities in 2019. This situation stresses the need for an intelligent transport system (ITS) that improves road safety and security by avoiding human errors with the use of autonomous vehicles (AVs). Therefore, this survey discusses the current development of two main components of an ITS: (1) gathering... » read more

Shared-Write-Channel-Based Device for High-Density Spin-Orbit-Torque Magnetic Random-Access Memory
By Technical Paper Link - 28 Feb, 2021 - Comments: 0

ABSTRACT "Spin-orbit-torque (SOT) devices are promising candidates for the future magnetic memory landscape, as they promise high endurance, low read disturbance, and low read error, in comparison with spin-transfer torque devices. However, SOT memories are area intensive due to the requirement for two access transistors per bit. Here, we report a multibit SOT cell that has a single write chan... » read more

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