System-Level Benefits Of The Versal Platform
By Xilinx - 01 Sep, 2021 - Comments: 0

Moore's Law has fueled the technological prosperity of the last 50 years, but it is generally believed now that Gordon Moore's 1965 forecast about the pace of innovation no longer holds true today. Continuing the silicon architectures of yesterday cannot meet the expanding demands of tomorrow's workloads. Frequently highlighted by today’s leaders in the field of computer architecture, to meet... » read more

40 GHz VCO and Frequency Divider in 28 nm FD-SOI CMOS Technology for Automotive Radar Sensors
By Technical Paper Link - 31 Aug, 2021 - Comments: 0

Abstract: "This paper presents a 40 GHz voltage-controlled oscillator (VCO) and frequency divider chain fabricated in STMicroelectronics 28 nm ultrathin body and box (UTBB) fully depleted silicon-on-insulator (FD-SOI) complementary metal-oxide–semiconductor (CMOS) process with eight metal layers back-end-of-line (BEOL) option. VCOs architecture is based on an LC-tank with p-type metal-oxide�... » read more

Manufacturing Bits: Aug. 31
By Mark LaPedus - 31 Aug, 2021 - Comments: 0

X-ray nanotomography The U.S. Department of Energy’s (DOE) Argonne National Laboratory has developed a new method for improving the resolution of hard X-ray nanotomography. In general, tomography involves a system, which takes images or cross sections of a sample using X-rays or ultrasound. The images are then re-created in the form of a 3D model. One common form is called micro-comput... » read more

58th DAC Online Program Is Now Live
By Michelle Clancy Fuller - 31 Aug, 2021 - Comments: 0

We did it. After more than a year’s worth of hard work the DAC Executive Committee finally released the 58th DAC program, despite a mountain of challenges and hurdles we encountered along the way this past year. We started planning the 58th DAC a little over a year ago, and we were confronted with a lot of uncertainty on what to expect for the coming year. Would submissions be down? Would ... » read more

Power/Performance Bits: Aug. 31
By Jesse Allen - 31 Aug, 2021 - Comments: 0

Securing memory Researchers at Columbia University suggest several ways to make computing more secure without imposing a system performance penalty. The efforts focus on memory security, specifically pointers. "Memory safety has been a problem for nearly 40 years and numerous solutions have been proposed. We believe that memory safety continues to be a problem because it does not distribute... » read more

Analyzing Electro-Photonic Systems
By Brian Bailey - 30 Aug, 2021 - Comments: 1

The design and analysis of electro-optical systems is pushing tools into the complex multi-physics domain, making it challenging to create models that execute at reasonable cost — especially when they include thermal impacts. The lack of models and standards also is slowing the progression of the technology. Still the advantages are worth it to those willing to make the investment. Trad... » read more

Inner Spacer Engineering to Improve Mechanical Stability in Channel-Release Process of Nanosheet FETs
By Technical Paper Link - 28 Aug, 2021 - Comments: 0

  Abstract "Mechanical stress is demonstrated in the fabrication process of nanosheet FETs. In particular, unwanted mechanical instability stemming from gravity during channel-release is covered in detail by aid of 3-D simulations. The simulation results show the physical weakness of suspended nanosheets and the impact of nanosheet thickness. Inner spacer engineering based on geometr... » read more

Four-Period Vertically Stacked SiGe/Si Channel FinFET Fabrication and Its Electrical Characteristics
By Technical Paper Link - 28 Aug, 2021 - Comments: 0

Li Y, Zhao F, Cheng X, Liu H, Zan Y, Li J, Zhang Q, Wu Z, Luo J, Wang W. Four-Period Vertically Stacked SiGe/Si Channel FinFET Fabrication and Its Electrical Characteristics. Nanomaterials (Basel). 2021 Jun 28;11(7):1689. doi: 10.3390/nano11071689. PMID: 34203194; PMCID: PMC8307669. Find technical paper here. Abstract "In this paper, to solve the epitaxial thickness limit and the high in... » read more

Variational Quantum Algorithms (VQA)
By Technical Paper Link - 27 Aug, 2021 - Comments: 0

  Abstract "Applications such as simulating large quantum systems or solving large-scale linear algebra problems are immensely challenging for classical computers due their extremely high computational cost. Quantum computers promise to unlock these applications, although fault-tolerant quantum computers will likely not be available for several years. Currently available quantum device... » read more

Chiplet-Based Advanced Packaging Technology from 3D/TSV to FOWLP/FHE
By Technical Paper Link - 27 Aug, 2021 - Comments: 0

T. Fukushima, "Chiplet-Based Advanced Packaging Technology from 3D/TSV to FOWLP/FHE," 2021 Symposium on VLSI Circuits, 2021, pp. 1-2, doi: 10.23919/VLSICircuits52068.2021.9492335. Abstract: "More recently, "chiplets" are expected for further scaling the performance of LSI systems. However, system integration with the chiplets is not a new methodology. The basic concept dates back well over ... » read more

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