Manufacturing Bits: Dec. 29

By Mark LaPedus - 29 Dec, 2020 - Comments: 1

Chiplet-based exascale computers At the recent IEEE International Electron Devices Meeting (IEDM), CEA-Leti presented a paper on a 3D chiplet technology that enables exascale-level computing systems. The United States and other nations are working on exascale supercomputers. Today’s supercomputers are measured in floating point operations per second. The world’s fastest supercomputers c... » read more

Power/Performance Bits: Dec. 29

By Jesse Allen - 29 Dec, 2020 - Comments: 0

Safer Li-ion batteries Scientists from Stanford University and the Department of Energy's SLAC National Accelerator Laboratory propose a way to make lithium-ion batteries lighter, more efficient, and fire resistant. One of the heaviest components of lithium-ion batteries are the copper or aluminum sheets that act as current collectors. "The current collector has always been considered de... » read more

2020: A Turning Point In The Chip Industry

By Brian Bailey - 28 Dec, 2020 - Comments: 3

At the start of 2020, most of the industry was upbeat and sales forecasts for the year were good. Then the pandemic hit, and fear gripped most of the industry — but not for long. New markets emerged, demand increased, and the levels of innovation went far beyond what had been forecast. While hope is on the horizon that the virus will be contained during 2021, life will not return to the ol... » read more

Week In Review: Manufacturing, Test

By Mark LaPedus - 24 Dec, 2020 - Comments: 0

Government and trade The U.S. Bureau of Industry and Security (BIS) has expanded its export control regulations for U.S.-based hi-tech companies. The BIS has added more companies to its “Military End User” (MEU) list. The list involves 103 entities, which includes 58 Chinese and 45 Russian companies. The U.S. government has determined that these companies are “military end users” or th... » read more

Week In Review: Design, Low Power

By Jesse Allen - 24 Dec, 2020 - Comments: 0

Tortuga Logic was awarded a $12 million SBIR Phase III contract from the US Government to foster the development of advanced hardware security solutions. Ansys will collaborate with Tortuga Logic to advance side-channel leakage analysis workflows. “The award will allow us to rapidly expand our solution to address new classes of hardware weaknesses in the physical domain that are critical to t... » read more

Week In Review: Auto, Security, Pervasive Computing

By SE Staff - 24 Dec, 2020 - Comments: 0

Automotive/Mobility Apple wants to have self-driving cars in production by 2024, and that timeframe includes having its own battery technology, according to Reuters. Project Titan, the name of Apple’s automotive efforts, has seen its ups and downs, but now Apple has a clearer view of what its strength and niche will be — consumer self-driving cars with a longer range, less expensive batter... » read more

Manufacturing Bits: Dec. 23

By Mark LaPedus - 23 Dec, 2020 - Comments: 0

Magnetic glue Nanyang Technological University (NTU) Singapore has developed a new magnetic-activated glue technology. Conventional glue or adhesives involve epoxy and related materials. These adhesives are used to bond plastics, ceramics and wood. The adhesives are bonded and cured using moisture, heat or light. The curing temperatures range from room temperature to 80 degrees Celsius. ... » read more

Why It’s So Hard To Stop Cyber Attacks On ICs

By Ed Sperling - 23 Dec, 2020 - Comments: 0

Semiconductor Engineering sat down to discuss security risks across multiple market segments with Helena Handschuh, security technologies fellow at Rambus; Mike Borza, principal security technologist for the Solutions Group at Synopsys; Steve Carlson, director of aerospace and defense solutions at Cadence; Alric Althoff, senior hardware security engineer at Tortuga Logic; and Joe Kiniry, princi... » read more

Blog Review: Dec. 23

By Jesse Allen - 23 Dec, 2020 - Comments: 0

Cadence's Paul McLellan checks out how Arm is becoming a powerhouse in the server and high-end space with the addition of new R&D and a focus on getting the most out of its architecture. Siemens EDA's Harry Foster continues his look at verification trends in FPGAs by checking out adoption of different simulation and formal technologies. Synopsys' Taylor Armerding looks ahead to 2021 w... » read more

Power/Performance Bits: Dec. 23

By Jesse Allen - 23 Dec, 2020 - Comments: 0

Detecting early damage in power electronics Researchers at Osaka University to detect early damage in power electronics. The team used acoustic emission analysis to monitor in real time the propagation of cracks in a silicon carbide Schottsky diode during power cycling tests. During the power cycling test, the researchers mimicked repeatedly turning the device on and off, to monitor the res... » read more

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