category: Blogs – MD

category: IoT, Security & Automotive

Enabling Curvilinear Masks
By eBeam Initiative - 18 Jun, 2020 - Comments: 0

This talk by Leo Pang, Chief Product Officer of D2S, takes a look at a unique GPU-accelerated approach to curvilinear inverse lithography technology (ILT) and introduces mask-wafer co-optimization (MWCO) that enables writing curvilinear ILT for 193i on VSB or multi-beam machines in 12 hours. » read more

The Future Of Mobility: Autonomous, Connected, Electric, Shared
By Bettina Weiss - 18 Jun, 2020 - Comments: 3

By Bettina Weiss and Sven Beiker As the amount of electronics in automobiles continues to increase, it is becoming more common to hear a vehicle referred to as a “computer on wheels.” To that end, innovation occurs at the intersection of automotive and microelectronics so that leveraging synergies and contemplating joint initiatives becomes crucial in shaping the future of both fields. I... » read more

Introducing Nanosheets Into Complementary-Field Effect Transistors (CFETs)
By Benjamin Vincent - 01 Jun, 2020 - Comments: 0

In our November 2019 blog [1], we discussed using virtual fabrication (SEMulator3D) to benchmark different process integration options for Complementary-FET (CFET) fabrication. CFET is a CMOS architecture that was proposed by imec in 2018 [2]. This architecture contains p- and n-MOSFET structures built on top of each other, instead of having them located side-by-side. In our previous blog, we r... » read more

Best Practices In Business Continuity Planning
By Heidi Hoffman - 21 May, 2020 - Comments: 0

Cameron Burks, head of Global Security, Enterprise Business Resiliency and Health, Environment & Safety with Adobe Systems, and a member of the White House Task Force for COVID-19 response, briefed members of SEMI’s IT Leadership (ITL) and Environment, Health & Safety (EHS) groups on April 20, 2020, on enterprise resiliency principals specific to the current COVID-19 crisis. Burk... » read more

Fan-Out Wafer-Level Packaging And Copper Electrodeposition
By Steven T. Mayer - 21 May, 2020 - Comments: 0

By Steven T. Mayer, Bryan Buckalew, and Kari Thorkelsson As integrated circuit designers bring more sophisticated chip functionality into smaller spaces, heterogeneous integration, including 3D stacking of devices, becomes an increasingly useful and cost-effective way of mixing and connecting various functional technologies. One of the heterogeneous integration platforms gaining increased ac... » read more

Identifying And Preventing Process Failures At 7nm
By Qingpeng Wang - 20 Apr, 2020 - Comments: 0

Device yield is highly dependent upon proper process targeting and variation control of fabrication steps, particularly at advanced nodes with smaller feature sizes. Traditionally, cross-correlation and analysis of thousands of test data points have been required to identify and prevent process failures. This is very costly in terms of both time and money. Fortunately, semiconductor virtual fab... » read more

Taking A Pulse On The IC Biz
By Mark LaPedus - 16 Apr, 2020 - Comments: 0

It’s been a difficult period for the semiconductor industry. The coronavirus outbreak has put a damper on what was supposed to be a strong year in the semiconductor industry in 2020. Many are holding out hopes for a rebound in the second half of the year. That’s still a big unknown. The forecasts are gloomy. For example, VLSI Research has three different scenarios for the semiconduc... » read more

Gradual Rebound Or Slight Dip
By Sungho Yoon - 16 Apr, 2020 - Comments: 0

Uncertainty has gripped the silicon wafer market as the COVID-19 pandemic threatens to upend growth projections for 2020. Declines in both shipments and revenue plagued the silicon wafer market in 2019, a downturn that had given way to optimism for 2020 with rising expectations for normalizing inventory levels, memory market improvements, data center market growth and the 5G market takeoff. ... » read more

Artificial Intelligence Is Everywhere
By Shelly Miyasato - 16 Apr, 2020 - Comments: 0

It’s pretty hard to talk about technology today without artificial intelligence, or AI, entering into the conversation. It seems to be everywhere… and growing. Businesses are using it to operate more efficiently, it’s resulting in safer and more useful products, and it has the promise of allowing us to personalize our worlds as devices learn our preferences. The age of AI AI refers to t... » read more

The Impact Of EUV Resist Thickness On Via Patterning Uniformity
By Benjamin Vincent - 30 Mar, 2020 - Comments: 0

Via patterning at advanced nodes requires extremely low critical dimension (CD) values, typically below 30nm. Controlling these dimensions is a serious challenge, since there are many inherent sources of variation during lithography and etch processing. Coventor personnel, in conjunction with our colleagues from ASML and imec, recently looked at the impact of Extreme Ultraviolet lithography (EU... » read more

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