category: Blogs – MD

category: IoT, Security & Automotive

Semicon West Lithography Report
By Chris Mack - 29 Sep, 2013 - Comments: 0

OK, I have to admit this right off:  I didn’t go to Semicon West (held two weeks ago in San Francisco).  I try never to go to Semicon West (I’ve been twice in the last 30 years, both times against my will).  Why should I go?  To listen to the latest marketing messages and company spin?  To see a few technical talks that are way too light on the technical, but still full of talk?  I do... » read more

SPIE Advanced Lithography 2013 – day 2
By Chris Mack - 29 Sep, 2013 - Comments: 0

There were some great papers at AL on Tuesday.  Here are some of my favorites.  Peter Trefonas of Dow created a photosensitive block copolymer using a class of molecules called bottle brush polymers.  This very early work nonetheless exhibited very good results – close to 20 nm resolution (e-beam litho) with nearly the first bottle of stuff they mixed up.  The idea is simple:  marry the ... » read more

Risk Vs. Reward
By Ed Sperling - 19 Sep, 2013 - Comments: 0

One of the most persistent business myths is that deep pockets in challenging times always win in the end. While that has proven a successful model in many industries where the barrier to entry is enormous and rising, in the technology world the outcome isn’t always what you’d expect even with those same variables. In fact, the history of technology is littered with former business giant... » read more

Dissecting The Numbers
By Jim Feldhan - 19 Sep, 2013 - Comments: 0

In the annals of semiconductor history, July is typically the worst month of the year in terms of sequential monthly change. Going back to 1997, semiconductor sales in July are usually down 10% to over 30%. The chart below shows a pictorial representation of the monthly percent change in July over June for the last 16 years. We’re not implying that everyone should break out the party hats,... » read more

Should EDA Heads Be In The Cloud?
By Brian Fuller - 19 Sep, 2013 - Comments: 0

Consider the following two comments about cloud computing and electronic design automation: “Over time everybody will move to the cloud in EDA at least in some extent.”—Raik Brinkmann, CEO of OneSpin Solutions. “We put a substantial effort into that, and of all the things we've done in the last 25 years this is probably the single one where the result is essentially zero. I don't ... » read more

You Ain’t Seen Nothing Yet
By David Abercrombie - 19 Sep, 2013 - Comments: 1

I’ve been talking about double patterning for a long time now in this series of blogs. I thought it might be good to start looking ahead at what is next for multi-patterning (Don’t Panic!). As you may have been hearing or reading, it doesn’t look like EUV lithography is going to be ready for 10nm, and may not even make it for 7nm. This means that alternative methods of extending the exist... » read more

Time To Meet A Patterning Master… An Octopus
By Michael Watts - 12 Sep, 2013 - Comments: 0

Animals that can adaptively camouflage are always rather fascinating, but how about an octopus that sees in black and white and can vary its color and texture? There is a fabulous video clip from Roger Hanlon, senior scientist at Woods Hole Marine Biological Laboratory that found me through various friends (thanks to Facebook). Roger Hanlon said that “when I captured the first scene I started... » read more

Materials Innovation Key To Enabling Next-Generation Mobile Devices
By Kathryn Ta - 09 Sep, 2013 - Comments: 0

By Kathryn Ta There’s a lot of excitement building regarding several new mobile product announcements on the horizon, including a concept smartwatch, a new phablet and a new smartphone. These products are sure to be on a lot of consumers’ wish lists this holiday season, and users will expect them to have a sleeker look and feel, while running applications instantly, providing all-day batte... » read more

Semiconductor Fab Materials Outlook
By SEMI - 16 Aug, 2013 - Comments: 0

By Dan Tracy While segments of the global economy are slowing and uncertainty is once again on the rise, fundamental unit trends for semiconductor materials have improved in recent months and growth expectations for the fab materials market remain modest for 2012 and into 2013. Three-month shipment data shows silicon shipments—from the wafer suppliers to the fabs—during the current cycl... » read more

450mm Is On Its Way!
By Adrienne Downey - 15 Aug, 2013 - Comments: 0

By Adrienne Downey Intel finally has taken the big plunge into 450mm manufacturing with the announcement of the start of construction of fab D1X Module 2. The company plans to spend $2 billion on construction of the new development fab this year alone. Its twin fab, Module 1, is 450mm-compatible, but will begin production later this year as a 300mm fab running a 14nm process technology. Intel�... » read more

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