category: Low Power-High Performance

category: IoT, Security & Automotive

Confusion Grows Over Packaging And Scaling
By Ann Mutschler - 15 Oct, 2020 - Comments: 0

The push toward both multi-chip packaging and continued scaling of digital logic is creating confusion about how to classify designs, what design tools work best, and how to best improve productivity and meet design objectives. While the goals of design teams remains the same — better performance, lower power, lower cost — the choices often involve tradeoffs between design budgets and ho... » read more

SystemVerilog Constraints
By Mentor, a Siemens Business - 14 Oct, 2020 - Comments: 0

This paper looks at two of the most common issues when constraint solver results do not match your intent: Not understanding how Verilog expression evaluation rules apply to interpret the rules of basic algebra and not understanding the affect probability has on choosing solution values. Coding recommendations for improving your code to get better results are provided. To read more, click here. » read more

Maximizing Ansys LS-DYNA Performance With AMD EPYC 7Fx2 Processors
By Ansys - 14 Oct, 2020 - Comments: 0

AMD EPYC 7Fx2 processors bring high frequencies and very highs ratios of cache per core to the 2nd Gen EPYC family of processors. EPYC 7Fx2 processors build on the large memory capacity, extreme memory bandwidth and massive I/O of the 2nd Gen EPYC family to deliver exceptional HPC workload performance. This paper describes the excellent performance of these chips in running Ansys LS-DYNA comput... » read more

IP Security Assurance Standard
By Accellera - 14 Oct, 2020 - Comments: 0

This whitepaper is available from the IP Security Assurance (IPSA) Working Group that describes Accellera’s initial proposal to address the industry’s security concerns involving IP integration. Since integrators typically treat IP as a “black box,” vulnerabilities may inadvertently be inserted into an SoC/ASIC. The whitepaper details the objectives of the IPSA standard and its approach... » read more

13-Gb/s Transmitter For Bunch Of Wires Chip-To-Chip Interface Standard
By Fraunhofer IIS/EAS - 14 Oct, 2020 - Comments: 0

Continuous downscaling of integrated circuits has reached a bottleneck. Technologies such as system in a package, multi-chip module and integration of chips on an active or passive interposer can further improve the system performance. Bunch of wires interface standard was recently introduced for chip to chip short interfaces within a package. This standard required both terminated and untermin... » read more

Security Verification of Rambus’ CryptoManager Root of Trust by Tortuga Logic
By Rambus - 14 Oct, 2020 - Comments: 0

The confidentiality and integrity of cryptographic key material is critical to maintaining system security. A hardware root of trust, such as the Rambus CryptoManager Root of Trust, is designed to securely generate, store, and employ cryptographic keys. Tortuga Logic has independently verified the policies surrounding access to keys stored within registers in the CryptoManager Root of Trust usi... » read more

Power/Performance Bits: Oct. 12
By Jesse Allen - 12 Oct, 2020 - Comments: 0

More stable quantum states Researchers at the University of Chicago found a way to make quantum systems retain coherency 10,000 times longer. The fragile nature of quantum states remains a challenge for developing practical applications of quantum computing, as they can be easily disrupted by background noise coming from vibrations, temperature changes or stray electromagnetic fields. Ap... » read more

Power/Performance Bits: Oct. 6
By Jesse Allen - 06 Oct, 2020 - Comments: 0

Waste plastic supercapacitor Researchers from the University of California Riverside found a way to recycle waste plastic into energy storage devices. The work focused on polyethylene terephthalate plastic waste, or PET, which is found in soda bottles and many other consumer products. The researchers first dissolved pieces of PET plastic bottles in a solvent. Using electrospinning, they fab... » read more

112G SerDes Reliability
By Ed Sperling - 05 Oct, 2020 - Comments: 0

Priyank Shukla, product marketing manager at Synopsys, digs into 112Gbps SerDes, why it’s important to examine the performance of these devices in the context of a system, what is acceptable channel loss, and how density can affect performance, power and noise. » read more

Cerfe Labs: Spin-On Memory
By Ed Sperling - 05 Oct, 2020 - Comments: 0

Arm has spun off one of its more intriguing semiconductor research projects, a new non-volatile memory type called correlated electron materials RAM (CeRAM) that holds the potential to substantially reduce the cost of memory in everything from edge devices to high-performance computing. Headed by two former Arm Research insiders — Eric Hennenhoefer, who will serve as CEO and Greg Yeric, wh... » read more

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