category: Low Power-High Performance

category: IoT, Security & Automotive

Can Software Testing Deliver ROI?
By Mike Wager - 09 Nov, 2023 - Comments: 0

Innovation happens at a lightning pace, where software applications must follow suit or risk obsolescence. Consequently, quality assurance (QA) teams face a constant battle to ensure functionality, quality, and speed of release for their digital products. Software testing is critical to deliver in the face of this ever-increasing pressure. However, it is often seen as a burden, a cost center th... » read more

Placement And CTS Techniques For High-Performance Computing Designs
By Siemens EDA - 09 Nov, 2023 - Comments: 0

This paper discusses the challenges of designing high-performance computing (HPC) integrated circuits (ICs) to achieve maximum performance. The design process for HPC ICs has become more complex with each new process technology, requiring new architectures and transistors. We highlight how the Siemens Aprisa digital implementation solution can solve placement and clock tree challenges in HPC de... » read more

Startup Funding: October 2023
By Jesse Allen - 08 Nov, 2023 - Comments: 0

Investors are betting heavily on data center technology, with October funding going to companies developing data processing units (DPUs) to accelerate a variety of tasks, a near-memory distributed dataflow architecture for AI, and liquid cooling technology. Much of this is linked to the build-out of the edge, closer to the source of the data than the cloud but not as compute-intensive. Other ... » read more

3D Heterogenous Integration: Design And Verification Challenges
By Ansys - 08 Nov, 2023 - Comments: 0

Next-generation semiconductor products increasingly rely on vertical integration technologies to drive system density, speed, and yield improvement. Due to the increased coupling effects across multiple physics, co-simulation and co-analysis of these phenomena are critical for a robust chip-package-system design. Advanced 2.5D/3D-IC systems are constructed with multiple dice, interposers, packa... » read more

Vision Transformers Change The AI Acceleration Rules
By Quadric.io - 08 Nov, 2023 - Comments: 0

Transformers were first introduced by the team at Google Brain in 2017 in their paper, "Attention is All You Need". Since their introduction, transformers have inspired a flurry of investment and research which have produced some of the most impactful model architectures and AI products to-date, including ChatGPT which is an acronym for Chat Generative Pre-trained Transformer. Transformers a... » read more

Thermal Warpage Simulation Of A Temperature-Dependent Linear Elastic Material Package
By Cadence - 08 Nov, 2023 - Comments: 0

The shift to advanced packaging in 3D and 2.5D IC design is making the numerical analysis of thermal warpage in electronic devices a crucial part of the design process. A reliable numerical tool enables the designer to perform early design analysis that accurately predicts warpage, thereby shortening the design process. The Cadence Celsius Thermal Solver integrated within the Cadence IC, pac... » read more

Research Bits: November 6
By Jesse Allen - 06 Nov, 2023 - Comments: 0

Fast superatomic semiconductor Researchers from Columbia University created a fast and efficient superatomic semiconductor material based on rhenium called Re6Se8Cl2. Rather than scattering when they come into contact with phonons, excitons in Re6Se8Cl2 bind with phonons to create new quasiparticles called acoustic exciton-polarons. Although polarons are found in many materials, those in Re6Se... » read more

Research Bits: October 24
By Jesse Allen - 24 Oct, 2023 - Comments: 0

Photonic-electronic hardware processes 3D data Researchers from the University of Oxford, University of Muenster, University of Heidelberg, and University of Exeter are developing integrated photonic-electronic hardware capable of processing three-dimensional data, which the team claims boosts data processing parallelism for AI tasks. The researchers added an extra parallel dimension to the... » read more

Research Bits: October 17
By Jesse Allen - 17 Oct, 2023 - Comments: 0

High-entropy multielement ink semiconductors Researchers from Lawrence Berkeley National Laboratory and UC Berkeley developed a high-entropy semiconducting material called ‘multielement ink’ that can be processed at low-temperature or room temperature. “The traditional way of making semiconductor devices is energy-intensive and one of the major sources of carbon emissions,” said Pei... » read more

Memory Technologies Key To Advancing AI Applications
By Tim Messegee - 12 Oct, 2023 - Comments: 0

Memory is an integral component in every computer system, from the smartphones in our pockets to the giant data centers powering the world’s leading-edge AI applications. As AI continues to rise in reach and complexity, the demand for more memory from data center to endpoints is reshaping the industry’s requirements and traditional approaches to memory architectures. According to OpenAI,... » read more

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