Developers Embrace Standards To Accelerate Growth Opportunities For The IoT


By the end of the decade, the potential economic value of the Internet of Things (IoT) is expected to reach $12.6 trillion (yes, that’s a ‘t,’ not a typo), according to a McKinsey study. To achieve the scale required to meet this opportunity, critical IoT standards are coming together to enable the frictionless deployment of secure endpoint-to-cloud solutions – and being embraced by th... » read more

Balancing Power And Heat In Advanced Chip Designs


Power and heat use to be someone else's problem. That's no longer the case, and the issues are spreading as more designs migrate to more advanced process nodes and different types of advanced packaging. There are a number of reasons for this shift. To begin with, there are shrinking wire diameters, thinner dielectrics, and thinner substrates. The scaling of wires requires more energy to driv... » read more

Complete Reliability Verification For Multiple-Power-Domain Designs


With increasing design complexity and a heightened focus on reliability at all levels of integrated circuit (IC) design from intellectual property (IP) to full-chip, accurate and full verification coverage of the different reliability concerns within an IC design is essential. Designs containing multiple power domains add more complexity to reliability verification with the need to validate int... » read more

Enabling Accurate Electronic-Photonic Co-Design with a Synergetic Workflow on GlobalFoundries Fotonix Platform


Massive growth in research, development, and applications of CMOS-compatible integrated photonics in recent years, along with its expected potential for the years to come, has sparked an ever-increasing demand from designers for seamless and all-inclusive design automation solutions that can enable electronic-photonic co-design while being accurate and easy to use. Here, we demonstrate an end-t... » read more

Innovate By Customized Instructions, But Without Fragmenting The Ecosystem


This white paper reviews the design considerations for SoC designers when they deploy their hardware accelerators, and how software developers access the accelerators implemented using Arm Custom Instructions. Click here to read more. » read more

Unleash The Potential of CFD


Classic CFD to High-Order Scalability Instead of relying on expensive prototype testing or experimentation, users now have access to numerous open-source and paid computational fluid dynamics (CFD) software that can help them solve application-specific problems. Today, CFD is no longer about getting one solution at a time; it is about getting the best possible solution from multiple design tes... » read more

How Low Can You Go? Pushing The Limits Of Transistors


Rising demand for cutting-edge mobile, IoT, and wearable devices, along with high compute demands for AI and 5G/6G communications, has driven the need for lower power systems-on-chip (SoCs). This is not only a concern for a device’s power consumption when active (dynamic power), but also when the device is not active (leakage power). This highly competitive industry provides significant rewar... » read more

Research Bits: Nov. 7


ADC side-channel attacks Researchers at MIT propose two ways to protect analog-to-digital converters (ADCs) from power and electromagnetic side-channel attacks. The researchers first investigated the side-channel attacks that could be used against ADCs. Power attacks usually involve an attacker soldering a resistor onto the device’s circuit board to measure its power usage. An electromagn... » read more

Startup Funding: October 2022


Investors poured $3.5 billion into 113 startup companies in October 2022, especially new battery technology, AI hardware, and faster memory access. Battery technology dominated the fundraising in October thanks to the U.S. Department of Energy and four funding rounds that exceeded $200M. The DOE awarded sizeable grants to help 20 companies, including six startups, build out battery material ... » read more

What’s So Different About Interposer Signal Integrity?


By Kelly Damalou and Pete Gasperini To achieve gains in power, performance, area, and cost, 3D-IC architectures are pushing electronics design to new limits. Silicon integration technology and associated devices have undergone an impressive evolution over the last several decades. Their development encourages technological advancement in applications like high-performance computing, Artificial... » read more

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