category: Low Power-High Performance

category: IoT, Security & Automotive

Active Learning: Integrating Natural Intelligence Into Artificial Intelligence
By Oliver Gnepper - 09 Jun, 2022 - Comments: 0

Today, very few people would likely deny the fact that data can present major added value for companies. But analyzing data from production processes reveals the incompleteness of data collection and the associated reduced potential of the data that can be leveraged. Typical shortcomings include: Incomplete representation of processes in the dataspace, Inadequate connection of processes... » read more

Emulation-Centric Power Analysis Of SoC Designs
By Lauro Rizzatti - 09 Jun, 2022 - Comments: 0

Verification expert Lauro Rizzatti recently interviewed Jean-Marie Brunet, senior marketing director, Scalable Verification Solutions Division (SVSD), Siemens EDA, about the importance of accurate power estimation and optimization for system-on-chip (SoC) designs. What is the problem facing the semiconductor industry today regarding pre-silicon power estimation? The problem is the discrep... » read more

Video Compression Enables Cutting-Edge Displays
By Emma-Jane Crozier - 09 Jun, 2022 - Comments: 0

Display technology has advanced in leaps and bounds. We can now create professional-quality video content on our mobiles, and our cars often have more displays than our living room. In recent years, electronics manufacturers have been using increasingly sophisticated display feature sets as a way of differentiating their products in the highly competitive consumer electronics market. Each new g... » read more

DRAM Thermal Issues Reach Crisis Point
By Karen Heyman - 09 Jun, 2022 - Comments: 5

Within the DRAM world, thermal issues are at a crisis point. At 14nm and below, and in the most advanced packaging schemes, an entirely new metric may be needed to address the multiplier effect of how thermal density increasingly turns minor issues into major problems. A few overheated transistors may not greatly affect reliability, but the heat generated from a few billion transistors does.... » read more

IP Industry Transformation
By Brian Bailey - 09 Jun, 2022 - Comments: 0

The design IP industry is developing an assortment of new options and licensing schemes that could affect everything from how semiconductor companies collaborate to how ICs are designed, packaged, and brought to market. The IP market already has witnessed a sweeping shift from a "design once, use everywhere" approach, to an "architect once, customize everywhere" model, in which IP is highly ... » read more

Bringing RFIC Design And Verification Into The Modern Era
By Jian Yang - 09 Jun, 2022 - Comments: 0

For decades, developers of radio frequency (RF) chips and other analog/mixed-signal (AMS) integrated circuits (ICs) have used traditional techniques for design and verification. Most RFIC designers have continued to hand-craft active and passive devices, manually place and route their circuits, and rely on the bring-up lab to validate their pre-silicon SPICE simulations. It is often said that a... » read more

Khronos: Open Standards Powering The Future Of Embedded Vision
By Paul McLellan - 09 Jun, 2022 - Comments: 0

At the recent Embedded Vision Summit, one of the presentations was by Neil Trevett of The Khronos Group. This is a standardization body and is a non-profit. He said that his day job is at Nvidia. It has been creating standards for 20 years with a focus on low-level hardware acceleration APIs for 3D graphics, parallel computation, augmented reality (AR), virtual reality (VR), and machine learnin... » read more

Multiphysics Signoff Solvers At DAC 2022
By Marion Blanc - 09 Jun, 2022 - Comments: 0

It seems like just yesterday when engineers were trying to fit all the functionality they could onto a monolithic 2D integrated circuit to maximize computing performance. Moore’s Law was going strong and standard chips were what everybody used. The Design Automation Conference (DAC) 2022, scheduled for July 10 to 14 in San Francisco, will show just how far we’ve come from those days. We�... » read more

Co-Packaged Optics In The Data Center
By Ed Sperling - 08 Jun, 2022 - Comments: 0

Just because faster Ethernet is added to the data center doesn’t mean existing hardware can utilize it efficiently. Scott Durrant, strategic marketing manager at Synopsys, talks with Semiconductor Engineering about the rapid rollout of faster Ethernet rates, problems in moving data to the front module of the switch and how much energy is required, and what optical technology can bring to the ... » read more

How New Storage Technologies Enhance HPC Systems
By Synopsys - 08 Jun, 2022 - Comments: 0

High-performance computing (HPC) has historically been available primarily to governments, research institutions, and a few very large corporations for modeling, simulation, and forecasting applications. As HPC platforms are being deployed in the cloud for shared services, high-performance computing is becoming much more accessible, and its use is benefiting organizations of all sizes. Increasi... » read more

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