category: Manufacturing, Packaging and Materials

category: IoT, Security & Automotive

The High Price Of Smaller Features
By Katherine Derbyshire - 15 Sep, 2022 - Comments: 0

The semiconductor industry’s push for higher numerical apertures is driven by the relationship between NA and critical dimension. As the NA goes up, the CD goes down: Where λ is the wavelength and k1 is a process coefficient. While 0.55 NA exposure systems will improve resolution, Larry Melvin, principal engineer at Synopsys, noted that smaller features always come with a process cos... » read more

Services Beyond Packaging, Summer 2022 Newsletter
By QP Technologies - 15 Sep, 2022 - Comments: 0

Technology Focus: Services Services Beyond Packaging: QP Technologies is known for offering a wide range of package types. We also provide a variety of semiconductor manufacturing services to meet your packaging and assembly requirements. These include wafer preparation (backgrinding, dicing, die sort and inspection), IC assembly processes for a variety of package types and materials, laser ... » read more

Smart Manufacturing And Advanced Technical Service
By Serena Brischetto - 15 Sep, 2022 - Comments: 0

SEMI spoke with Eyal Shekel, senior vice president of Service Strategy and Excellence at Tokyo Electron Limited, about the impact of artificial intelligence (AI) on smart manufacturing and how other fab solutions for smarter process tools are advancing semiconductor manufacturing. SEMI: AI technology is considered a key enabler for smart manufacturing. What are the latest trends? Shekel:... » read more

Next Generation Chip Embedding Technology For High Efficiency Power Modules and Power SiPs
By ASE - 15 Sep, 2022 - Comments: 0

Cost, performance, and package size are some of the key drivers required in the next generation of package interconnect and package structure evolution. Embedding active die into substrates was mainly driven by package miniaturization for communication handheld devices. However, in the case of power modules, miniaturization is not the only driver that enhances the need for embedded die substrat... » read more

Week In Review: Manufacturing, Test
By Karen Heyman - 09 Sep, 2022 - Comments: 0

Some funding details are now available for the CHIPS Act in the U.S. The Biden Administration plans to spend the money in the following ways: $28 billion to establish domestic production of leading-edge logic and memory chips through grants, subsidized loans or loan guarantees; $10 billion to increase production of current-generation semiconductors and chips, and $11 billion for rese... » read more

Week In Review: Manufacturing, Test
By Karen Heyman - 02 Sep, 2022 - Comments: 0

New fab construction At an event in Arizona, U.S. Commerce Secretary Gina Raimondo urged states to compete for funding made available for producing semiconductors by the U.S. federal government. Indeed, several companies are already doing just that. The latest developments include: Micron plans to invest approximately $15 billion through 2030 for a new memory fab near its existing headquart... » read more

MicroLEDs Move Toward Commercialization
By Laura Peters - 29 Aug, 2022 - Comments: 1

The market for MicroLED displays is heating up, fueled by a raft of innovations in design and manufacturing that can increase yield and reduce prices, making them competitive with LCD and OLED devices. MicroLED displays are brighter and higher contrast than their predecessors, and they are more efficient. Functional prototypes have been developed for watches, AR glasses, TVs, signage, and au... » read more

Week In Review: Manufacturing, Test
By Karen Heyman - 26 Aug, 2022 - Comments: 0

Regional Shifts Supply chains are moving away from China. Apple, Honda, and Mazda are in line to diversify their manufacturing across different regions, according to one report. Another report says Apple plans to manufacture some of its new iPhone 14s in India. Mexico wants to be part of U.S.’s drive to move chip manufacturing closer to home, hosting American financiers to discuss elect... » read more

Week In Review: Manufacturing, Test
By Karen Heyman - 19 Aug, 2022 - Comments: 0

The U.S. Commerce Department issued export controls on key technologies, including gallium oxide (Ga2O3) and diamond substrates, which are used at high voltages and temperatures, as well as EDA tools specifically developed for GAA FETs. It's not clear how this will impact EDA companies, because many of the tools that will be used for designing for GAA FETs already are in use today for finFETs. ... » read more

Big Changes In Architectures, Transistors, Materials
By Ed Sperling - 18 Aug, 2022 - Comments: 0

Chipmakers are gearing up for fundamental changes in architectures, materials, and basic structures like transistors and interconnects. The net result will be more process steps, increased complexity for each of those steps, and rising costs across the board. At the leading-edge, finFETs will run out of steam somewhere after the 3nm (30 angstrom) node. The three foundries still working at th... » read more

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