category: Test, Measurement and Analytics

category: IoT, Security & Automotive

Wireless Trend Predictions For 2024 And Their Impact On The Test And Measurement Industry
By Niklas Nolemo - 09 Jan, 2024 - Comments: 0

The ever-evolving landscape of wireless technology continues to shape how we connect, communicate, and innovate. Connected systems continue to grow in complexity and reliance on one another which will impact the test & measurement industry significantly.  As we step into the year 2024, several key wireless trends are set to dominate the industry, ushering in a new era of connectivity and r... » read more

Meeting The Test Challenges Of Ultra-Wideband Chipsets
By Kevin Yan - 09 Jan, 2024 - Comments: 0

By Kevin Yan and Daniel Sun This article is adapted from a paper and presentation at SEMICON China, March 2023. Ultra-wideband (UWB) technology, as defined by IEEE 802.15.4 and 802.15.4z standards, enables short-range, low-power RF location-based services and wireless communication. A variety of devices have reached the market to help implement UWB capability, but these devices present si... » read more

In-Product BTI Aging Sensor For Reliability Screening And Early Detection Of Material At Risk
By PDF Solutions - 09 Jan, 2024 - Comments: 0

We have developed a new reliability monitoring suite, within a proprietary IP block that we call a CV Core, with aging sensors embedded in the product layout and testable through the product I / O interface. We illustrate the application of the sensor suite with an example of the PMOS NBTI monitor, testable at the wafer level during product electrical wafer sort (EWS), as well after packaging a... » read more

Unlocking Value: The Power of AI in Semiconductor Test
By Advantest - 09 Jan, 2024 - Comments: 0

AI (Artificial Intelligence) and data analytics empower semiconductor manufacturers to extract valuable insights from the massive amounts of data generated throughout the silicon lifecycle. By leveraging AI algorithms, semiconductor manufacturers can optimize silicon design, assembly, and testing processes. Through the analysis of vast datasets, AI can identify patterns, predict failures, and o... » read more

Empowering Universities By Retaining Raman Knowledge
By Inga Koehler - 09 Jan, 2024 - Comments: 0

A big chunk of precious research funds spent on an expensive piece of equipment, for example a Raman microscope. Now, such a magnificent piece of hardware can seem quite intimidating. After all, it could be capable of building a spaceship! Now a poor graduate student must face copious amounts of training, becoming a real expert over the span of 3 to 4 years. Mostly because the professor ... » read more

Using Deep Data For Improved Reliability Testing
By Ed Sperling - 08 Jan, 2024 - Comments: 0

Reliability testing always has been a challenge for semiconductor companies, but it’s becoming much more difficult as devices continue to shrink, as they’re integrated together in advanced packages, and as they’re utilized under different conditions with life expectancy that varies by application and use case. Nir Sever, senior director of business development at proteanTecs, and Luca Mor... » read more

Testing ICs Faster, Sooner, And Better
By Laura Peters - 12 Dec, 2023 - Comments: 0

The infrastructure around semiconductor testing is changing as companies build systems capable of managing big data, utilizing real-time data streams and analysis to reduce escape rates on complex IC devices. At the heart of these tooling and operational changes is the need to solve infant mortality issues faster, and to catch latent failures before they become reliability problems in the fi... » read more

Closing The Test And Metrology Gap In 3D-IC Packages
By Gregory Haley - 12 Dec, 2023 - Comments: 0

The industry is investing in more precise and productive inspection and testing to enable advanced packages and eventually, 3D ICs. The next generations of aerospace, automotive, smartphone, and wearable tech most likely will be powered by multiple layers of intricately connected silicon, a stark departure from the planar landscapes of traditional integrated circuits. These 3D-ICs, compos... » read more

Fingerprinting Chips For Traceability
By Anne Meixner - 12 Dec, 2023 - Comments: 0

Semiconductor components increasingly require unclonable and tamper resistant identifiers, which are especially necessary as devices become increasingly heterogeneous collections of chiplets and subsystems. These fingerprints provide traceability, which contributes to process improvements and yield learning and enable tracking for a tightly managed supply chain. While some of this technology... » read more

A Bare Wafer Mystery: Inspecting For Back, Edge, And Notch Defects In Advanced Nodes
By Burhan Ali - 12 Dec, 2023 - Comments: 0

It is no mystery that the semiconductor industry is always advancing, with specifications becoming increasingly stringent as defects become increasingly more difficult to discover. This is especially true in the case of the most advanced nodes, where ever-smaller flaws and deformities can result in a killer defect. To solve this More than Moore mystery, you do not need to employ the detectiv... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2024 SMG   |  Terms of Service  |  Privacy Policy