Using Deep Data Analytics To Enhance Reliability Testing The Fast Roadmap for Zero Defects


proteanTecs and ELES have partnered together to enhance reliability testing with deep data analytics. This collaboration enables SoC manufacturers to improve their qualification envelope to achieve lifetime reliability, shorten their root cause analysis time, and reduce operational costs. This innovative approach adds parametric measurements during the stress test in order to accurately and pre... » read more

Data, System Reliability, and Privacy


Experts at the Table: Semiconductor Engineering sat down to discuss changes in test that address tracing device quality throughout a product’s lifetime, and over-arching concerns about data ownership and privacy, with Tom Katsioulas, CEO at Archon Design Solutions and U.S. Department of Commerce IoT advisory board member; Ming Zhang, vice president of R&D Acceleration at PDF Solutions; a... » read more

Chip Industry Week In Review


By Gregory Haley, Jesse Allen, and Liz Allan TSMC told equipment vendors to delay deliveries of the most advanced tools due to uncertain demand, according to Reuters. The news drove down stock prices of all the major equipment providers. On the other hand, TSMC said advanced packaging shortages will constrain AI chip shipments for the next 18 months, according to NikkeiAsia. The United St... » read more

Fab And Field Data Transforming Manufacturing Processes


The ability to capture, process, and analyze data in the field is transforming semiconductor metrology and testing, providing invaluable insight into a product's performance in real-time and under real-world conditions and use cases. Historically, data that encapsulates parameters such as power consumption, temperature, voltages, currents, timing, and other characteristics, was confined to d... » read more

Customizing IC Test To Improve Yield And Reliability


Testing the performance and power of semiconductors as they come off the production line is beginning to shift left in the fab, reversing a long-standing trend of assessing chips just prior to shipping. While this may sound straightforward, it's a difficult challenge which, if successful, will have broad implications for the entire design-through-manufacturing flow. Manufacturers typically g... » read more

The Glass Substrate Question: When Will It Replace Copper Clad Laminate?


"When will glass replace copper clad laminate on advanced IC substrates?" That’s a question many on the heterogeneous integration (HI) side of the semiconductor industry are asking. Unfortunately, the answer is not straightforward. But before we get to answering that, let’s take an advanced IC substrate (AICS) refresher. In other words, how did we get to the point where glass substrat... » read more

The Growing Importance Of PMIC Validation


In the ever-evolving world of technology, the semiconductor industry plays a pivotal role in shaping the devices we use daily. Among the countless components that make up these devices, Power Management Integrated Circuits (PMICs) have emerged as unsung heroes, silently ensuring the efficient use of power resources. PMICs are specialized integrated circuits designed to manage and regulate th... » read more

Automotive Safety Requires PVT Monitoring IP Within Semiconductor ICs


The modern automobile, especially with the move toward more electrification, presents huge challenges to the designers of vehicular electronics. Gone are the days of mechanical issues and oil changes being primary concerns. Today’s automobile has a high number of semiconductor chips performing functions for self-driving autonomous systems, advanced driver assistance systems (ADAS), connectivi... » read more

Test Strategies In The Era Of Heterogeneous Integration


Moore’s Law, the observation that the number of transistors on an integrated circuit doubles approximately every two years, is critical to advances in computing technology. For decades, fabs have managed to achieve exponential growth in digital capability and transistor density by making transistors smaller and smaller, but we’ve hit the physical limits of these processes. Today, new proces... » read more

MMAF Option Enables Picoampere Measurements


By Yoshiyuki Aoki and Tsunetaka Akutagawa Demand for low-current devices is increasing, as many new sensors are being created for medical, automotive, industrial, and other applications. Chief among the heightened production and test requirements for these low-current devices is the need to achieve picoampere (pA)-class measurements. Sensors’ functionality and efficacy, especially in medic... » read more

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