category: IoT and Security

category: IoT, Security & Automotive

Fully Coupled CFD Simulations for Micro Gas Turbine Engines
By Cadence - 09 Jan, 2025 - Comments: 0

This conference paper offers a detailed exploration of the fully coupled CFD simulation of a KJ66 micro gas turbine (MGT) engine—an innovative approach that enhances the accuracy and fidelity of 3D numerical analysis. Key Takeaways: Integrated Approach: Unlike traditional component-by-component analysis, fully coupled simulations account for the interactions between the compressor, co... » read more

Power And Sensing Selection Guide 2024-2025
By Infineon - 09 Jan, 2025 - Comments: 0

This latest edition of the power & sensing selection guide compares our products’ key benefits and the latest power and sensing technology advancements to find what you need for your designs. Technologies covered include: MOSFETs, MCUs, power management ICs, wide-bandgap semiconductors, sensors, power switches, USB-C and more. Read more here. » read more

Auto Ecosystem Begins Shift To Software-First
By Ann Mutschler - 30 Dec, 2024 - Comments: 0

Experts at the Table: The automotive ecosystem is in the midst of an intense evolution as OEMs and tiered providers grapple with how to deal with legacy technology while incorporating ever-increasing levels of autonomy, electrification, and software-defined vehicle concepts. Semiconductor Engineering sat down to discuss these and other related issues with Wayne Lyons, senior director for the au... » read more

ESD Verification For 2.5D And 3D-ICs
By Siemens EDA - 10 Dec, 2024 - Comments: 0

Ensuring your integrated circuit (IC) design can withstand electrostatic discharge (ESD) events without incurring damage or failure is an extremely important activity in IC circuit design and verification. While automated flows for ESD verification are well-established for regular 2D ICs, 2.5D and 3D integration presents new challenges in both ESD design and verification. The new automated ESD ... » read more

Efficient ESD Verification For 2.5/3D Automotive ICs
By Dina Medhat - 09 Dec, 2024 - Comments: 0

Protection against electrostatic discharge (ESD) events is an extremely important aspect of integrated circuit (IC) design and verification, particularly for 2.5/3D designs targeted for automotive systems. ESD events cause severe damage to ICs due to a sudden and unexpected flow of electrical current between two electrically charged objects. This current may be caused by contact, an electrical ... » read more

Auto Chip Aging Accelerates In Hot Climates
By Ed Sperling - 09 Dec, 2024 - Comments: 1

Automotive chips are aging significantly faster than expected in hot climates with sustained high temperatures, raising concerns about the reliability of electrified vehicles over time and whether advanced-node chips are the right choice for safety-critical applications. Many of the most advanced electronics used in vehicles today are ASIL D-compliant, expected to function up to 125° C. But... » read more

Enhancing Compute Security Architecture For New-Age Applications
By Ajay Kapoor - 05 Dec, 2024 - Comments: 0

New-age AI-powered applications are becoming increasingly essential in our daily lives. Continuing to do so requires that these applications and services meet three primary challenges: Achieving high performance for complex compute tasks. Ensuring cost-effectiveness and seamless integration with existing infrastructure. Maintaining robust security and privacy measures. Historicall... » read more

USB4 Sideband Channel Is Not a Side Business
By Neelabh Krishnan - 05 Dec, 2024 - Comments: 0

The USB4 specification has been around for several years now. Two years ago, USB4 version 2.0 was also released by the USB Promoter Group. This specification enables up to 80Gbps link speed per direction in symmetric mode and 120Gbps link speed in asymmetric mode. Be it Gen 2, Gen 3, or Gen 4 link speeds of 20Gbps, 40Gbps, 80Gbps, or 120Gbps, the sideband channel is indispensable for the sta... » read more

The Future Of Technology: Generative AI In China
By Eleanor Brash - 05 Dec, 2024 - Comments: 0

China's investment in Gen-AI is projected to surge with an estimated 86% CAGR over the next five years. This growth is driven by a focus on technological self-sufficiency, from applications to chips, and a strong emphasis on locally developed technology. Key areas of development include: AI Chip Development: Addressing the need for powerful AI infrastructure. Dataset Localization: S... » read more

Advancing AI At The IoT Edge
By Deepak Mital - 05 Dec, 2024 - Comments: 0

In a highly connected world, there is a need for more intelligent and secure computation locally and preferably on the very devices that capture data, whether it be raw or compressed video, images, or voice. End markets continue to expect compute costs to trend down, at a time when computation demands are increasing, as is evident from recently popularized AI paradigms such as large language mo... » read more

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