category: System-Level Design

category: IoT, Security & Automotive

EDA In The Cloud Is Driving Semiconductor Innovation
By Nebabie Kebebew - 22 Dec, 2021 - Comments: 0

In the past decade, the move towards cloud computing occurred primarily in sectors like finance, retail, and healthcare, with the emergence of leading public cloud vendors such as Amazon Web Services (AWS), Microsoft Azure, Google Cloud Platform, and others accelerating the trend. However, the chip design industry has been slower to adopt cloud computing. In the current highly competitive en... » read more

Growth And Enthusiasm At The RISC-V Summit 2021
By Rupert Baines - 22 Dec, 2021 - Comments: 0

We weren’t sure what to expect from our first major attendance at a #RISCVSummit. Although we were a founding member of RISC-V – as we’ve been saying quite a lot recently – we have been hiding our light under a bushel. We’ve certainly been busy though – enabling over 2 billion RISC-V cores with our RISC-V processor IP and Studio tools while helping customers use architecture lice... » read more

Taking 2.5D/3DIC Physical Verification To The Next Level
By Siemens EDA - 21 Dec, 2021 - Comments: 0

As package designs evolve, so do verification requirements and challenges. Designers working on multi-die, multi-chiplet stacked configurations in 2.5/3D IC designs can use Calibre 3DSTACK physical verification checks to verify die alignments for proper connectivity and electrical behavior. The Calibre 3DSTACK precheck mode enables design teams to find and correct basic implementation mistakes ... » read more

Holistic FMEDA-Driven Safety Design And Verification For Analog, Digital, And Mixed-Signal Design
By Cadence - 21 Dec, 2021 - Comments: 0

With state-of-the-art electronics propelling the automotive industry into the future, automotive OEMs require safety-certified semiconductors. The integration of these advanced technologies into cars drives a need for component suppliers to assess and audit the risk of the technologies they want to deploy. At the same time, safety requirements are constantly evolving and becoming more stringent... » read more

Blog Review: Dec. 21
By Jesse Allen - 21 Dec, 2021 - Comments: 0

Cadence's Paul McLellan points to Log4J, a logging utility with a new major vulnerability that could affect hundreds of millions of devices, what's being done to address it, and why the underlying problems may be around for decades. Siemens EDA's Ray Salemi continues explaining how to use Python for verification by checking out the Python logging module for pyuvm and how it compares to UVM r... » read more

Flexible USB4-Based Interface IP Solution For AI At The Edge
By Synopsys - 21 Dec, 2021 - Comments: 0

Consumers have become accustomed to smart devices that are powered by advances in artificial intelligence (AI). To expand the devices’ total addressable market, innovative device designers build edge AI accelerators and edge AI SoCs that support multiple use cases and integration options. This white paper describes a flexible USB4-based IP solution for edge AI accelerators and SoCs. The IP so... » read more

Week In Review: Design, Low Power
By Jesse Allen - 17 Dec, 2021 - Comments: 0

Memory CEA-Leti demonstrated 16-kbit ferroelectric random-access memory (FeRAM) arrays at the 130nm node. It utilizes back-end-of-line (BEOL) integration of TiN/HfO2:Si/TiN ferroelectric capacitors as small as 0.16 µm² and solder reflow compatibility for the first time for this type of memory. The researchers anticipate it will be useful for embedded applications such at IoT and wearable dev... » read more

Blog Review: Dec. 15
By Jesse Allen - 15 Dec, 2021 - Comments: 0

Arm's Hannah Peeler, Joshua Randall, and Zach Lasiuk examine the carbon cost of data centers and introduce a tool that allows users to make informed decisions about the carbon impact of their compute workloads. Synopsys' Kenneth Larsen provides a primer on the fundamentals of quantum computing, the role of photonics in building quantum systems, and the future potential impact on chip design.... » read more

The Return Of DAC In-Person
By Brian Bailey - 15 Dec, 2021 - Comments: 0

Apart from masked faces everywhere, you could be excused for not knowing that there was a pandemic going on. Sure, the numbers were down, the show floor was smaller, and most of the parties didn't happen, but everyone was so happy to be able to bump elbows with their colleagues. Buttons were available for attendees to show the level of comfort they had with various types of greetings, from "... » read more

Blog Review: Dec. 8
By Jesse Allen - 08 Dec, 2021 - Comments: 0

Arm's Shidhartha Das introduces a method to achieve fast yet accurate power modelling for both design and runtime power introspection within the same unified framework using machine learning and data science approaches. Synopsys' Mike Borza warns that the semiconductor industry is facing a flood of counterfeit chips and why being aware of different types of semiconductor scams and tackling t... » read more

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