category: System-Level Design

category: IoT, Security & Automotive

How To Make Chiplets A Viable Market
By Paul McLellan - 23 Feb, 2023 - Comments: 0

At the recent Chiplet Summit, there was a panel session on the last afternoon titled "How to Make Chiplets a Viable Market." The panel was moderated by Meta's Ravi Agarwal, and the panelists were (from left to right in the photo): Travis Lanier of Ventana Micro Systems...actually Travis couldn't make it and Ventana was represented by Charles, but I didn't catch his last name Clint Walk... » read more

Dealing With Performance Bottlenecks In SoCs
By Brian Bailey - 23 Feb, 2023 - Comments: 0

A surge in the amount of data that SoCs need to process is bogging down performance, and while the processors themselves can handle that influx, memory and communication bandwidth are straining. The question now is what can be done about it. The gap between memory and CPU bandwidth — the so-called memory wall — is well documented and definitely not a new problem. But it has not gone away... » read more

Beyond Human Reach: Meeting Design Targets Faster With AI-Driven Optimization
By James Chuang - 23 Feb, 2023 - Comments: 0

The implementation flow for semiconductor devices is all about optimizing for power, performance, area (PPA), or some combination of these attributes. The history of this flow in electronic design automation (EDA) tools is all about adding more automation, tightening iterative loops, and reducing the number of iterations. The goal is converging to the PPA targets faster while using fewer resour... » read more

Fast, Focused Early-Stage Circuit Verification Can Get You To Signoff Faster
By Kesmat Shahin - 23 Feb, 2023 - Comments: 0

Designers everywhere know that with the increasing complexity of integrated circuits (ICs), meeting tapeout schedules has become increasingly difficult. While there are often many reasons for missing tapeouts, one critical component is the significant amount of time needed to run the signoff layout verification cycle, which contributes to overall signoff process duration. Much of this schedule ... » read more

Make The Right Choices For Enhanced Security On RISC-V
By David Marsden - 23 Feb, 2023 - Comments: 0

Two things are certain to make their presence felt at Embedded World 2023: the growing presence of RISC-V and the importance of safety and security in any embedded system. The breadth of RISC-V applications is expanding rapidly from IoT, mobile devices, to high performance computing, automotive and more. Its adoption, along with RISC-V International memberships, is also expanding from start... » read more

Smart Energy Metering For A Greener Future
By Toshio Kimura - 23 Feb, 2023 - Comments: 0

One of the key ways we will realize a sustainable future is to optimize—and essentially reduce—our energy usage. Optimization starts with understanding how much energy we consume every day. And to understand this, we must measure the power we consume in everyday applications. The smart meter is an important tool to help us transition to a “greener” use of energy. What is a smart ene... » read more

Achieve Dramatic Productivity And Turnaround Time Improvements In Early Design Electrical Rule Checking
By Siemens EDA - 22 Feb, 2023 - Comments: 0

Early-stage layout vs. schematic (LVS) and circuit verification typically return large numbers of connectivity errors, which can be a critical bottleneck for both LVS and physical verification flows that require correct connectivity for valid results. The Calibre nmLVS Recon tool targets essential and relevant early-stage circuit verification pain points, such as electrical rule checking (ERC) ... » read more

Smart Devices Enabled To Efficiently Communicate, Sense, Hear, Act And Interact With User
By Renesas - 22 Feb, 2023 - Comments: 0

The latest advancements in embedded systems and communication and sensing technology have led to the increasing development of smart applications. This has been a continuously evolving process, involving either the creation of completely new solutions or the rapid transformation of existing ones into corresponding highly smart environments. The main driving forces of the smart transformation ha... » read more

Blog Review: Feb. 22
By Jesse Allen - 22 Feb, 2023 - Comments: 0

Siemens EDA's Harry Foster observes that the FPGA market continues to go through a similar complexity curve that the IC/ASIC market experienced in the early and mid-2000 timeframe. Synopsys' Mitch Heins explores the benefits of heterogeneous integration of lasers and active gain elements in a silicon-based photonic IC, including reduced system costs, size, weight, and power along with improv... » read more

Advanced Modulation And Coding Challenges
By Keysight - 22 Feb, 2023 - Comments: 0

Demands for a connected world with instant data access continue to drive data center transceiver innovation. 100 gigabit Ethernet (GE) data transmission is in production and will continue to evolve. But 100GE speeds aren’t fast enough to support the expected surge in connected devices and the applications they will run, opening the door for 400GE. Non-return-to-zero (NRZ) and four-level pulse... » read more

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