category: Top Stories

category: IoT, Security & Automotive

200mm Demand Surges
By Mark LaPedus - 17 Dec, 2020 - Comments: 1

A surge in demand for various chips is causing shortages for select 200mm foundry capacity as well as 200mm fab equipment, and it shows no signs of abating in 2021. Foundry customers will face a shortfall of 200mm capacity at select foundries at least in the first half of 2021, and perhaps beyond. Those customers will need to plan ahead to ensure they obtain enough 200mm capacity in 2021. Ot... » read more

The Darker Side Of Hybrid Bonding
By Katherine Derbyshire - 17 Dec, 2020 - Comments: 2

With semiconductors, it's often things everyone takes for granted that cause the biggest headaches, and that problem is compounded when something fundamental changes — such as bonding two chips together using a process aimed at maximizing performance. Case in point: CMP for backend of the line metallization in hybrid bonding. While this is a mature process, it doesn't easily translate for ... » read more

AI And High-NA EUV At 3/2/1nm
By Mark LaPedus - 16 Dec, 2020 - Comments: 1

Semiconductor Engineering sat down to discuss lithography and photomask issues with Bryan Kasprowicz, director of technology and strategy and a distinguished member of the technical staff at Photronics; Harry Levinson, principal at HJL Lithography; Noriaki Nakayamada, senior technologist at NuFlare; and Aki Fujimura, chief executive of D2S. What follows are excerpts of that conversation. To vie... » read more

Power Models For Machine Learning
By Brian Bailey - 14 Dec, 2020 - Comments: 1

AI and machine learning are being designed into just about everything, but the chip industry lacks sufficient tools to gauge how much power and energy an algorithm is using when it runs on a particular hardware platform. The missing information is a serious limiter for energy-sensitive devices. As the old maxim goes, you can't optimize what you can't measure. Today, the focus is on functiona... » read more

Re-Architecting SerDes
By Brian Bailey - 10 Dec, 2020 - Comments: 0

Serializer/Deserializer (SerDes) circuits have been helping semiconductors move data around for years, but new process technologies are forcing it to adapt and change in unexpected ways. Traditionally implemented as an analog circuit, SerDes technology has been difficult to scale, while low voltages, variation, and noise are making it more difficult to yield sufficiently. So to remain releva... » read more

Low Power Still Leads, But Energy Emerges As Future Focus
By Ann Mutschler - 10 Dec, 2020 - Comments: 1

In 2021 and beyond, chips used in smartphones, digital appliances, and nearly all major applications will need to go on a diet. As the amount of data being generated continues to swell, more processors are being added everywhere to sift through that data to determine what's useful, what isn't, and how to distribute it. All of that uses power, and not all of it is being done as efficiently as... » read more

Waking And Sleeping Create Current Transients
By Bryon Moyer - 10 Dec, 2020 - Comments: 0

Silicon power-saving techniques are helping to reduce the power required by data centers and other high-intensity computing environments, but they’ve also added a significant challenge for design teams. As islands on high-powered chips go to sleep and wake up, the current requirements change quickly. This happens in a few microseconds, at most. The rapid change of loading creates a challen... » read more

New Security Approaches, New Threats
By Ed Sperling - 09 Dec, 2020 - Comments: 0

New and different approaches to security are gaining a foothold as the life expectancy for advanced chips increases, and as emerging technologies such as quantum computing threaten to crack even the most complex encryption schemes. These approaches include everything from homomorphic encryption, where data is processed without being decrypted, to different ways of sending and receiving data ... » read more

Digital Test Bulks Up – Or Down
By Bryon Moyer - 08 Dec, 2020 - Comments: 2

Large digital integrated circuits are becoming harder to test in a time- and cost-efficient manner. AI chips, in particular, have tiled architectures that are putting pressure on older testing strategies due to the volume of test vectors required. In some cases, these chips are so large that they exceed reticle size, requiring them to be stitched together. New testing efficiencies are needed... » read more

Test Engineers In Very Short Supply
By SE Staff - 08 Dec, 2020 - Comments: 2

Semiconductor design, verification, manufacturing, and test requires an army of engineers, with each playing a special role. But increasingly, these disciplines also require additional training to be able to understand the context around their jobs, and that is making it harder to fill different positions at a time when the chip industry already is severely short-staffed. This is particularl... » read more

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