category: Top Stories

category: Auto, Security & Edge AI

Advanced Packaging For Automotive Chips
By Ann Mutschler - 02 Dec, 2021 - Comments: 0

Multiple types of chips may be better than one for dealing with large amounts and different types of data, but in automotive applications it's not entirely clear how or even whether they should be packaged together. The biggest problem with electronics in vehicles is the extreme range of temperatures, both within and outside of vehicles. Without adequate cooling, chips can age prematurely, s... » read more

Will Markets For ML Models Materialize?
By Bryon Moyer - 02 Dec, 2021 - Comments: 0

Developers are spending increasing amounts of time and effort in creating machine-learning (ML) models for use in a wide variety of applications. While this will continue as the market matures, at some point some of these efforts might be seen as reinventing models over and over. Will developers of successful models ever have a marketplace in which they can sell those models as IP to other d... » read more

Startup Funding: November 2021
By Jesse Allen - 01 Dec, 2021 - Comments: 0

There's nothing virtual about the level of interest in AR/VR startups. As the concept of the 'metaverse' becomes more widespread with Nvidia's recent GTC announcements and Facebook's rebranding, investors poured money into startups with enabling technology for augmented, virtual, and extended reality. Most of those are developing waveguides and other display technology that is light enough to b... » read more

Missing Interposer Abstractions And Standards
By Brian Bailey - 29 Nov, 2021 - Comments: 0

The design and analysis of an SoC based on an interposer is not for the faint of heart today, but the industry is aware of the challenges and is attempting to solve them. Until that happens, however, it will be a technique that only large companies can deploy because they need to treat everything almost as if it were a single die. The construction of large systems uses techniques, such as ab... » read more

Product Lifecycle Management For Semiconductors
By Brian Bailey - 23 Nov, 2021 - Comments: 1

Product lifecycle management (PLM) and the semiconductor industry have always been separate, but pressure is growing to integrate them. Automotive, IIoT, medical, and other industries see that as the only way to manage many aspects of their business, and as it stands, semiconductors are a large black box in that methodology. The technology space is driven by a mix of top down and bottom-up p... » read more

Advanced Packaging Shifts Design Focus To System Level
By Ann Mutschler - 23 Nov, 2021 - Comments: 0

Growing momentum for advanced packaging is shifting design from a die-centric focus toward integrated systems with multiple die, but it's also straining some EDA tools and methodologies and creating gaps in areas where none existed. These changes are causing churn in unexpected areas. For some chip companies, this has resulted in a slowdown in hiring of ASIC designers and an uptick in new jo... » read more

Gaps In The AI Debug Process
By Brian Bailey - 23 Nov, 2021 - Comments: 0

When an AI algorithm is deployed in the field and gives an unexpected result, it's often not clear whether that result is correct. So what happened? Was it wrong? And if so, what caused the error? These are often not simple questions to answer. Moreover, as with all verification problems, the only way to get to the root cause is to break the problem down into manageable pieces. The semico... » read more

China Accelerates Foundry, Power Semi Efforts
By Mark LaPedus - 22 Nov, 2021 - Comments: 4

China has unveiled several initiatives to advance its domestic semiconductor industry, including a new and massive fab expansion campaign in the foundry, gallium-nitride (GaN), and silicon carbide (SiC) markets. The nation is making a big push into what it calls “third-generation semiconductors,” which is a misnomer. The term actually refers to two existing and common power semiconductor... » read more

End In Sight For Chip Shortages?
By Mark LaPedus - 18 Nov, 2021 - Comments: 2

The current wave of semiconductor and IC packaging shortages is expected to extend well into 2022, but there are also signs that supply may finally catch up with demand. The same is true for manufacturing capacity, materials and equipment in both the semiconductor and packaging sectors. Nonetheless, after a period of shortages in all segments, the current school of thought is that chip suppl... » read more

The Race To Make Better Qubits
By Katherine Derbyshire - 18 Nov, 2021 - Comments: 0

One of the big challenges in quantum computing is getting qubits to last long enough to do something useful with them. After decades of research, there now appears to be tangible progress. The challenge with any new semiconductor technology is to improve performance by one or more orders of magnitude without discarding a half-century of progress in other areas. Qubits based on silicon quantu... » read more

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