category: Top Stories

category: IoT, Security & Automotive

Open-Source Verification
By Brian Bailey - 30 Jul, 2020 - Comments: 1

Ask different people what open-source verification means and you will get a host of different answers. They range from the verification of open-source hardware, to providing an open-source verification infrastructure, to providing open-source stream generators or reference models, to open-source simulators and formal verification engines. Verification is about reducing risk. "Verification is... » read more

RISC-V Gaining Traction
By Ed Sperling - 30 Jul, 2020 - Comments: 0

Part 1: Semiconductor Engineering sat down to discuss where and why RISC-V is doing well, with Zdenek Prikryl, CTO of Codasip; Helena Handschuh, a Rambus Security Technologies fellow; Louie De Luna, director of marketing at Aldec; Shubhodeep Roy Choudhury, CEO of Valtrix Systems; and Bipul Talukdar, North America director of applications engineering at SmartDV. What follows are excerpt of that ... » read more

Next Challenge: Parts Per Quadrillion
By Ed Sperling - 29 Jul, 2020 - Comments: 0

Requirements for purity of the materials used in semiconductor manufacturing are being pushed to unprecedented — and increasingly unprovable — levels as demand for reliability in chips over increasingly longer lifetimes continues to rise. And while this may seem like a remote problem for many parts of the supply chain, it can affect everything from availability of materials needed to make t... » read more

Challenges For A Post-Moore’s Law World
By Ed Sperling - 27 Jul, 2020 - Comments: 0

Semiconductor Engineering sat down to discuss challenges at the edge, the impact of open-source, and how to attract new talent, with Simon Segars, CEO of Arm; Joseph Sawicki, executive vice president of IC EDA at Mentor, a Siemens Business; Raik Brinkmann, CEO of OneSpin Solutions; Babak Taheri, CEO of Silvaco; John Kibarian, CEO of PDF Solutions; and Prakash Narain, CEO of Real Intent. The con... » read more

The Race To Much More Advanced Packaging
By Mark LaPedus - 23 Jul, 2020 - Comments: 2

Momentum is building for copper hybrid bonding, a technology that could pave the way toward next-generation 2.5D and 3D packages. Foundries, equipment vendors, R&D organizations and others are developing copper hybrid bonding, which is a process that stacks and bonds dies using copper-to-copper interconnects in advanced packages. Still in R&D, hybrid bonding for packaging provides mo... » read more

EDA On Board With New Package Options
By Ann Mutschler - 22 Jul, 2020 - Comments: 2

A groundswell of activity around multi-die integration and advanced packaging is pushing EDA companies to develop integration strategies that speed up time to sign-off, increase confidence that a design will work as expected, while still leaving enough room for highly customized solutions. Challenges range from how to architect a design, how to explore the best options and configurations, ho... » read more

What’s After 5G
By Bryon Moyer - 20 Jul, 2020 - Comments: 1

This year’s IEEE Symposia on VLSI Technology and Circuits (VLSI 2020) included a presentation by NTT Docomo that looked far into the future of cellular communications, setting the stage for a broad industry shift in communication. This is far from trivial. 5G only just recently entered the commercial world, and — especially with the higher millimeter-wave (mmWave) frequencies — it has ... » read more

Speeding Up The R&D Metrology Process
By Mark LaPedus - 16 Jul, 2020 - Comments: 0

Several chipmakers are making some major changes in the characterization/metrology lab, adding more fab-like processes in this group to help speed up chip development times. The characterization/metrology lab, which is generally under the radar, is a group that works with the R&D organization and the fab. The characterization lab is involved in the early analytical work for next-generati... » read more

Spiking Neural Networks Place Data In Time
By Katherine Derbyshire - 16 Jul, 2020 - Comments: 0

Artificial neural networks have found a variety of commercial applications, from facial recognition to recommendation engines. Compute-in-memory accelerators seek to improve the computational efficiency of these networks by helping to overcome the von Neumann bottleneck. But the success of artificial neural networks also highlights their inadequacies. They replicate only a small subset of th... » read more

Atomic Layer Etch Expands To New Markets
By Mark LaPedus - 16 Jul, 2020 - Comments: 0

The semiconductor industry is developing the next wave of applications for atomic layer etch (ALE), hoping to get a foothold in some new and emerging markets. ALE, a next-generation etch technology that removes materials at the atomic scale, is one of several tools used to process advanced devices in a fab. ALE moved into production for select applications around 2016, although the technolog... » read more

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