category: Top Stories

category: IoT, Security & Automotive

Finding Defects In IC Packages
By Mark LaPedus - 17 Dec, 2019 - Comments: 0

Several equipment makers are ramping up new inspection equipment to address the growing defect challenges in IC packaging. At one time, finding defects in packaging was relatively straightforward. But as packaging becomes more complex, and as it is used in markets where reliability is critical, finding defects is both more difficult and more important. This has prompted the development of a ... » read more

New Packaging Roadmap
By Katherine Derbyshire - 17 Dec, 2019 - Comments: 3

Historically, the electronics industry has drawn sharp distinctions between the integrated circuit chip, the package that protects it from the environment, and the board that connects it to other devices in a complete system. The circuit and systems worlds have been largely isolated from each other, using different tools, different processes, and different metrics for success. While integrated ... » read more

What’s Next For High Bandwidth Memory
By Mark LaPedus - 17 Dec, 2019 - Comments: 1

A surge in data is driving the need for new IC package types with more and faster memory in high-end systems. But there are a multitude of challenges on the memory, packaging and other fronts. In systems, for example, data moves back and forth between the processor and DRAM, which is the main memory for most chips. But at times this exchange causes latency and power consumption, sometimes re... » read more

Interdependencies Complicate IC Power Grid Design
By Ann Mutschler - 12 Dec, 2019 - Comments: 0

Creating the right power grid is a growing problem in leading-edge chips. IP and SoC providers are spending a considerable amount of time defining the architecture of logic libraries in order to enable different power grids to satisfy the needs of different market segments. The end of Dennard scaling is one of the reasons for the increased focus. With the move to smaller nodes, the amount of... » read more

A New Dawn For IP
By Brian Bailey - 12 Dec, 2019 - Comments: 0

The IP industry is changing again. The concept started as build once, use everywhere, but today it is more like architect once, customize everywhere. Few designs can afford sub-optimal IP for their application. The need for customized IP is driven by both leading-edge designs and the trailing markets, although for different reasons. While this customization is causing IP companies to transfo... » read more

Defining And Improving AI Performance
By Brian Bailey - 12 Dec, 2019 - Comments: 2

Many companies are developing AI chips, both for training and for inference. Although getting the required functionality is important, many solutions will be judged by their performance characteristics. Performance can be measured in different ways, such as number of inferences per second or per watt. These figures are dependent on a lot of factors, not just the hardware architecture. The optim... » read more

5 Major Shifts In Automotive
By Ed Sperling - 11 Dec, 2019 - Comments: 1

Much of the automotive industry has begun repositioning and retrenching over the past few months, pushing back the projected rollout for fully autonomous vehicles and changing direction on power sources and technology used in the next-generation of electric vehicles. Taken together, these shifts mark a significant departure for traditional automakers, which find themselves playing catch-up t... » read more

The Growing Challenges Of 5G Reliability
By Susan Rambo - 10 Dec, 2019 - Comments: 0

The test field is getting more complicated as chips become larger, more heterogeneous, and subject to almost constant changes. Nowhere is this more evident than in 5G, where standards are still evolving and use cases are still being defined. Without passing test, no technology advances. But those definitions are subject to change, and they can change again over time. The communications in... » read more

Gaps Emerge In Test And Analytics
By Ed Sperling - 10 Dec, 2019 - Comments: 0

Sensor and process drift, increased design complexity, and continued optimization of circuitry throughout its lifetime are driving test and analytics in new directions, requiring a series of base comparisons against which equipment and processes can be measured. In the design world this type of platform is called a digital twin, but in the test world there is no equivalent today. And as more... » read more

Testing In Context Gaining Ground
By Jeff Dorsch - 10 Dec, 2019 - Comments: 0

Testing in context is beginning to gain wider appeal as chip complexity increases, and as ICs are deployed in more safety-critical and mission-critical applications. While design in context has been the norm for SoCs for some time, a similar approach in test has been slow going. Cell-aware testing technology was first described a decade ago, and since then its adoption has been modest. But w... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2024 SMG   |  Terms of Service  |  Privacy Policy