category: Top Stories

category: IoT, Security & Automotive

Open Source Processors: Fact Or Fiction?
By Brian Bailey - 27 Jun, 2019 - Comments: 3

Open source processors are rapidly gaining mindshare, fueled in part by early successes of RISC-V, but that interest frequently is accompanied by misinformation based on wishful thinking and a lack of understanding about what exactly open source entails. Nearly every recent conference has some mention of RISC-V in particular, and open source processors in general, whether that includes keyno... » read more

Test Chips Play Larger Role At Advanced Nodes
By Ann Mutschler - 27 Jun, 2019 - Comments: 0

Test chips are becoming more widespread and more complex at advanced process nodes as design teams utilize early silicon to diagnose problems prior to production. But this approach also is spurring questions about whether this approach is viable at 7nm and 5nm, due to the rising cost of prototyping advanced technology, such as mask tooling and wafer costs. Semiconductor designers have long b... » read more

Debugging Complex SoCs
By Brian Bailey - 27 Jun, 2019 - Comments: 0

Semiconductor Engineering sat down to discuss the debugging of complex SoCs with Randy Fish, vice president of strategic accounts and partnerships for UltraSoC; Larry Melling, product management director for Cadence; Mark Olen, senior product marketing manager for Mentor, a Siemens Business; and Dominik Strasser, vice president of engineering for OneSpin Solutions. What follows are excerpts of ... » read more

Will Open-Source EDA Work?
By Kevin Fogarty - 26 Jun, 2019 - Comments: 4

Open-source EDA is back on the semiconductor industry's agenda, spurred by growing interest in open-source hardware. But whether the industry embraces the idea with enough enthusiasm to make it successful is not clear yet. One of the key sponsors of this effort is the U.S. Defense Advanced Research Projects Agency (DARPA), which is spearheading a number of programs to lower the cost of chip ... » read more

CEO Outlook: Rising Costs, Chiplets, And A Trade War
By Ed Sperling - 26 Jun, 2019 - Comments: 0

Semiconductor Engineering sat down to discuss what's changing across the semiconductor industry with Wally Rhines, CEO emeritus at Mentor, a Siemens Business; Jack Harding, president and CEO of eSilicon; John Kibarian, president and CEO of PDF Solutions; and John Chong, vice president of product and business development for Kionix. What follows are excerpts of that discussion, which was held in... » read more

Who’s Responsible For Security Breaches?
By Brian Bailey - 24 Jun, 2019 - Comments: 0

Semiconductor Engineering sat down to discuss industry attitudes towards safety and security with Dave Kelf, chief marketing officer for Breker Verification; Jacob Wiltgen, solutions architect for functional safety at Mentor, a Siemens Business; David Landoll, solutions architect for OneSpin Solutions; Dennis Ciplickas, vice president of characterization solutions at PDF Solutions; Andrew Dauma... » read more

5nm Vs. 3nm
By Mark LaPedus - 24 Jun, 2019 - Comments: 16

Foundry vendors are readying the next wave of advanced processes, but their customers will face a myriad of confusing options—including whether to develop chips at 5nm, wait until 3nm, or opt for something in between. The path to 5nm is well-defined compared with 3nm. After that, the landscape becomes more convoluted because foundries are adding half-node processes to the mix, such as 6nm ... » read more

What’s Next In Advanced Packaging
By Mark LaPedus - 20 Jun, 2019 - Comments: 3

Packaging houses are readying the next wave of advanced IC packages, hoping to gain a bigger foothold in the race to develop next-generation chip designs. At a recent event, ASE, Leti/STMicroelectronics, TSMC and others described some of their new and advanced IC packaging technologies, which involve various product categories, such as 2.5D, 3D and fan-out. Some new packaging technologies ar... » read more

Possible Uses Narrow For Negative Capacitance FETs
By Katherine Derbyshire - 20 Jun, 2019 - Comments: 1

The discovery of a ferroelectric phase in hafnium dioxide (HfO2) has sparked significant interest in opportunities for integration of ferroelectric transistors and memories with conventional CMOS devices. Demonstrations of “negative capacitance” behavior in particular suggest these devices might evade the 60 mV/decade limit on subthreshold swing, thereby improving transistor efficiency. ... » read more

Sidestepping Moore’s Law
By Mark LaPedus - 20 Jun, 2019 - Comments: 2

Calvin Cheung, vice president of engineering at ASE, sat down with Semiconductor Engineering to talk about advanced packaging, the challenges involved with the technology, and the implications for Moore’s Law. What follows are excerpts of that conversation. SE: What are some of the big issues with IC packaging today? Cheung: Moore’s Law is slowing down, but transistor scaling will co... » read more

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